Qualcomm Snapdragon 870 5G vs MediaTek Dimensity 7300
Qualcomm Snapdragon 870 5G
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The Qualcomm Snapdragon 870 5G Mobile Platform (SM8250-AC) is a high-end smartphone and tablet SoC that Qualcomm announced in mid 2021. The SoC integrates a fast ‘Prime Core’ that clocks up to 3.2 GHz and three additional ARM Cortex-A77 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz. Compared to the similar and older Snapdragon 865+, the Prime Core clocks 100 MHz faster and the GPU is slightly higher clocked.
Therefore, the Snapdragon 870 is slightly faster than the old Snapdragon 865 and 865 Plus and slots in behind the high end Snapdragon 888.
The Mobile Platform integrates a Qualcomm X55 5G modem with Sub-5 and mmWave support and global 5G bands with up to 7.5 GBit/s (download) speed. The SmartConnect 6800 modem supports Wi-Fi 6 with 8x8 MU-MIMU and 60 GHz 11ay up to 10 Gbps.
The integrated GPU is still called Adreno 650 and offers a slightly higher clock speed of 670 MHz.
The on board Hexagon 698 DSP now offers a KI performance of up to 15 TOPS (up from 7 TOPS in the 855) and still uses a combination of CPU, GPU, HVX and Tensor cores. The Spectra 480 ISP is also untouched. The integrated Computer Vision Engine (CV-ISP) now supports Dolby Vision, 8K videos and 200 megapixel photos.
The built-in memory controller supports LPDDR5 with up to 2,750 MHz and LPDDR4X with 2,133 MHz.
The SoC is manufactured in the modern and power efficient 7nm process.
MediaTek Dimensity 7300
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The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
| Model | Qualcomm Snapdragon 870 5G | MediaTek Dimensity 7300 | ||||||||||||
| Codename | Cortex-A77 / A55 (Kryo 585) | Cortex-A78 / A55 | ||||||||||||
| Series | Qualcomm Snapdragon | |||||||||||||
| Series: Snapdragon Cortex-A77 / A55 (Kryo 585) |
| |||||||||||||
| Clock | 2420 - 3200 MHz | 2000 - 2500 MHz | ||||||||||||
| L2 Cache | 1.8 MB | |||||||||||||
| L3 Cache | 7 MB | |||||||||||||
| Cores / Threads | 8 / 8 | 8 / 8 4 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | ||||||||||||
| TDP | 5 Watt | |||||||||||||
| Technology | 7 nm | 4 nm | ||||||||||||
| Features | Adreno 650 GPU, Spectra 480 ISP, LPDDR5 2750 MHz / LPDDR4X 2133 MHz Memory Controller | |||||||||||||
| iGPU | Qualcomm Adreno 650 ( - 670 MHz) | ARM Mali-G615 MP2 | ||||||||||||
| Architecture | ARM | ARM | ||||||||||||
| Announced | ||||||||||||||
| Manufacturer | www.qualcomm.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 870 5G → 100% n=14
Average Benchmarks MediaTek Dimensity 7300 → 97% n=14
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
