Qualcomm Snapdragon 845 vs UNISOC Tangula T770 vs MediaTek Dimensity 810

Qualcomm Snapdragon 845

The Qualcomm Snapdragon 845 Mobile Platform (or SD845) is a high-end SoC for smartphones that was introduced in early 2018 and manufactured in 10 nm LPP FinFET at TSMC. Integrates 4x Kryo 385 cores (Cortex-A75) at up to 2.8 GHz (max) for performance and 4x Kryo 385 at 1.8 GHz (max) for efficiency. Furthermore offers an X20 LTE modem (Cat. 18 1.2 Gbps downlink, Cat 13 150 Mbps uplink), ac-WiFi and a dual-channel 32-Bit 1866 MHz LPDDR4x memory controller.

UNISOC Tangula T770

The Unisoc T770 Tanggula (former Spreadtrum) is a mid range SoC for Android based smartphones and tablets. It integrates an octa-core CPU with three clusters. One fast ARM Cortex-A76 clocked at up to 2.5 GHz, three more A76 performance cores clocked at up to 2.2 GHz and a power efficiency cluster of four ARM-Cortex-A55 cores with up to 2 GHz. The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 Bit). The integrated ISP supports two main cameras and two subsidiary cameras (up to 108 MPix). The integrated graphics card is an ARM Mali-G57 MC4 (4 cores) at up to 780 MHz. Unisoc also specifies that the T770 offers hardware AI acceleration.

The chip is manufactured in the modern 6nm process.

MediaTek Dimensity 810

The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download. 

The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.