Qualcomm Snapdragon 732G vs MediaTek Dimensity 700 vs MediaTek Dimensity 810

Qualcomm Snapdragon 732G

The Qualcomm Snapdragon 732G (SD732G Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core) divided into two clusters. A fast performance cluster contains two ARM Cortex-A76 cores clocked at up to 2.3 GHz and a power efficiency cluster with six small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds. Compared to the 730G, the 732G offers a 100 MHz higher A76 CPU clock.

Compared to the normal Snapdragon 730, the 732G is optimized for gaming. This means the graphics card is higher clocked (also compared to the 730G, Qualcomm stateds 15% more performance) and the chip also offers optimized WiFi. The GPU also supports higher resolutions. Furthermore, the SoC is able to record videos in 720p with up to 960 fps.

The chip includes a range of other features like a fast X15 LTE radio (800 Mbits Cat 15 download, 150 Mbps Cat 13 upload), one of the first Wi-Fi 6 wireless radios (802.11ax), satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou, Galileo), USB-C 3.1, Spectra 350 ISP, Hexagon 688 DSP, H.265 4K30 video en- and decode, an LPDDR4X-3733 dual-channel memory controller and a Adreno 618 Grafikkarte.

The Snapdragon 732G is manufactured in the modern 8 nm process at Samsung.

MediaTek Dimensity 700

The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.

MediaTek Dimensity 810

The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download. 

The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.