Qualcomm Snapdragon 665 vs HiSilicon Kirin 960 vs HiSilicon Kirin 710

Qualcomm Snapdragon 665

The Qualcomm Snapdragon 665 (SM6125) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 260 cores (custom design, 64-Bit capable) that are divided in two clusters. A fast cluster of four cores with up to 2 GHz (Kryo 260 Gold - Cortex-A73 derivate) and a power saving efficiency cluster with up to 1.8 GHz (Kryo 260 Silver - Cortex A53 derivate). Both clusters can also be used together.

In addition to the 8 CPU cores, the SoC integrates a mid range Adreno 610 GPU with a LPDDR4 memory controller (dual-channel)  and supports Wi-Fi (802.11ac + MIMO, max. 867 Mbps), Bluetooth 5, and LTE (X12 LTE modem with up to 600 Mbps download and 150 Mbps upload).

Power Consumption

Thanks to the new 11 nm LPP process, the energy efficiency should be quite good.

HiSilicon Kirin 960

The HiSilicon Kirin 960 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 9 in November 2016. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G71 MP8 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE Cat. 12/13 modem. It is one of the fastest ARM SoCs in the end of 2016. The Kirin 960 is manufactured in a modern 16-nm process at TSMC.

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).