Leaked AMD RDNA 3 Navi 31 die shot confirms first ever GPU chiplet design hours before the official announcement

Back in August, Angstronomics was reporting on what looked like finalized specs for all of AMD’s upcoming RDNA 3 Navi 3 gaming GPU SKUs, with Navi 31 flagship supposedly getting a chiplet design (first ever on a GPU) integrating 1 GCD and 6 smaller MCDs. Less than half a day away from the official RDNA 3 reveal (1 PM PDT), Angstronomics leaked a die shot of the Navi 31 that appears to confirm the GCD + 6x MCD design. However, it looks like the MCDs are placed over and under the GCD and not on the sides.

Each MCD measures around 37.5 mm² and includes some amount of Infinity Cache, although the exact amount for all MCDs is still unknown. Angstronomics suggests it could be as high as 192 MB, in case AMD decides to go with a 3D stack. The GCD on the other hand, would measure around 308 mm² and is built on TSMC’s N5 nodes, unlike the MCDs that are produced on the N6 nodes.

Angstronomics estimates that the chiplet part with GCD and MCDs measures around 533 mm², while the whole package that includes the ABF substrate reinforced with a wide stiffener ring plus various decoupling capacitors could measure 2612 mm².

Previous rumors were alleging that AMD’s RX 7900 XT flagships would not really match the RTX 4090 from Nvidia, and Angstronomics seems to agree, yet we might see some aggressive pricing to compensate: “[...] our A0 performance profiling results were not indicative of production samples, so we have refrained from detailing our findings publicly. Silicon and board cost is definitely lower than NVIDIA’s RTX 4090, so let’s see where the two Navi 31 SKUs will be priced.”

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