HiSilicon Kirin 710 vs HiSilicon Kirin 710A

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).

HiSilicon Kirin 710A

The HiSilicon Kirin 710A is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It is based on the Kirin 710, but manufactured in 14nm FinFET at SMIC (China) versus the TSMC in 12nm. It was announced mid 2020 and contains 8 processor cores (4x Cortex-A73 at up to 2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower.