Mediatek Helio G85 vs Qualcomm Snapdragon 665 vs Mediatek Helio P90

Mediatek Helio G85

The Mediatek Helio G85 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.8 GHz for efficiency. All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 1000 MHz (up from 950 MHz from the otherwise similar Helio G80). The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory.

The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.

Qualcomm Snapdragon 665

The Qualcomm Snapdragon 665 (SM6125) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 260 cores (custom design, 64-Bit capable) that are divided in two clusters. A fast cluster of four cores with up to 2 GHz (Kryo 260 Gold - Cortex-A73 derivate) and a power saving efficiency cluster with up to 1.8 GHz (Kryo 260 Silver - Cortex A53 derivate). Both clusters can also be used together.

In addition to the 8 CPU cores, the SoC integrates a mid range Adreno 610 GPU with a LPDDR4 memory controller (dual-channel)  and supports Wi-Fi (802.11ac + MIMO, max. 867 Mbps), Bluetooth 5, and LTE (X12 LTE modem with up to 600 Mbps download and 150 Mbps upload).

Power Consumption

Thanks to the new 11 nm LPP process, the energy efficiency should be quite good.

Mediatek Helio P90

The Mediatek Helio P90 is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2019. It is manufactured in a 12 nm FinFET (12FFC) process and is equipped with 2x big ARM Cortex-A75 cores (2.2 GHz max.) and 6x small and power efficient ARM Cortex-A55 cores (2 GHz max.) in two clusters (bigLITTLE). The processor also integrates a Cat-12 (600 Mbps DL) / Cat-13 (150 Mbps UL) LTE Modem (4G), a PowerVR GM 9446 GPU, and ISP for 64 MP photos and 4K videorecording, and a AI Processing Unit with a theoretical performance of 1165 Giga-Multiply-Adds per second. The memory controller on the die supports dual-channel LPDDR4x-1866 (8 GB max.) and flash memory can be connected by UFS 2.1.

The CPU performance should be slightly below a Snapdragon 730 (e.g. in the Reno2 Z in our benchmarks) and therefore in the upper middle-class of 2019 smartphones.