Full Xiaomi Mi 9 spec list leaked in "new report"
The next Xiaomi flagship is likely to be called the Mi 9, and may be launched at the MWC in late February. The latest rumors surrounding this phone suggest that it will have a world-first 48 MP rear camera sensor. It will be integrated alongside 2 additional modules. In addition, the Mi 9 is projected to run on the latest Snapdragon 855 (SD 855) chipset. A new 'report' published by GizChina also purports to offer increased detail on this phone and its specifications.
This report reiterates the 48MP module-related leak, and assert that it will be accompanied by a 12MP and a time-of-flight (TOF) sensor, for improved 3D reproduction in images. The report also refers to the SD 855, albeit one coupled to the X24 4G/LTE modem and not the newer X50 5G-enabled model. The Mi 9 will also apparently feature a 6.4-inch full-HD+ display, into which an up-to-date fingerprint sensor will be integrated. This display will have a waterdrop notch to house a Sony IMX576 24 MP selfie camera.
The Mi 9 will also allegedly have a base model with 6GB RAM and 128GB of fixed storage. It will start at an estimated price of US$435, for which the owner may also get a 3500mAh battery and Android 9 (Pie) overlaid with MIUI 10 out of the box. This new report also claims that the Mi 9 will come with 32-watt fast charging, but without support for wireless charging.
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