The Samsung Exynos 850 is a System on a Chip (SoC) for entry level smartphones (Android based). It was announced in May 2020 and the first device with it is the Samsung Galaxy A21s. The chip integrates a processor with 8 small ARM Cortex-A55 cores that clock with up to 2 GHz (octa core).
The multi threaded performance is quite good thanks to 8 cores, the single threaded performance suffers a bit from the small A55 cores, although the clock rate of up to 2 GHz can help a bit.
Furthermore, the SoC integrates a LTE modem (Cat.7 2CA up to 300 MBit/s download, Cat.13 2CA 150 MBit/s upload), a Wi-fi 5 modem (802.11ac), LPPDDR4x memory controller, eMMC 5.1 flash memory controller and a video engine for FHD 60fps encoding and decoding (H.265, H.264, VP9).
It is manufactured in the modern 8nm LPP process at Samsung and should offer a good power efficiency and therefore it is also suited for small smartphones.
The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).
Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.
The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.
The UniSoc T765 is a mid-range SoC with 8 processor cores in two clusters. The two large ARM Cortex-A76 cores are clocked at up to 2.3 GHz. The six smaller cores run at up to 2.1 GHz.
The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 bit). The integrated ISP supports a camera up to 108 MPixel. The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) is used. The built-in 5G modem supports TDD+FDD CA in the sub-6GHz spectrum with 130 MHz bandwidth.
The chip is manufactured using the somewhat older 6nm process (EUV at TSMC).
Average Benchmarks MediaTek Dimensity 700 → 228%n=2
Average Benchmarks UNISOC T765 → 282%n=2
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
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