MediaTek Dimensity 820 vs MediaTek Dimensity 800 vs UNISOC T765

MediaTek Dimensity 820

The Mediatek Dimensity 820 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 5 core ARM Mali-G57 MC5 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0) and video de- and encoding. The Dimensity 820 is manufactured in the modern 7nm process and should be very power efficient.

MediaTek Dimensity 800

The Mediatek Dimensity 800 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores at up to 2 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 4 core ARM Mali-G57 MC4 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.

Compared to the similar named Dimensity 800U, the 800 offers two more big A76 cores but clocked 400 MHz lower. This means the single core performance is lower, but the multi-core performance can be better.

The Dimensity 800 is manufactured in the modern 7nm process and should be very power efficient.

UNISOC T765

The UniSoc T765 is a mid-range SoC with 8 processor cores in two clusters. The two large ARM Cortex-A76 cores are clocked at up to 2.3 GHz. The six smaller cores run at up to 2.1 GHz.

The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 bit). The integrated ISP supports a camera up to 108 MPixel. The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) is used. The built-in 5G modem supports TDD+FDD CA in the sub-6GHz spectrum with 130 MHz bandwidth.

The chip is manufactured using the somewhat older 6nm process (EUV at TSMC).