MediaTek Dimensity 7300 vs Qualcomm Snapdragon 865 vs MediaTek Dimensity 7030

MediaTek Dimensity 7300

The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.

In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.

The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.

Qualcomm Snapdragon 865

The Qualcomm Snapdragon 865 Mobile Platform is a high-end smartphone and tablet SoC that Qualcomm announced in December 2019. The SoC integrates a fast ‘Prime Core’ that clocks up to 2.84 GHz and three further fast ARM Cortex-A77 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz. The difference to the older Snapdragon 855 is the switch from Cortex-A76 to the faster Cortex-A77 architecture. The clock speeds stay the same. 

Therefore, the Snapdragon 865 takes the top spot in mobile processors for Android based systems. In some multi-core workloads, the SD865 can even perform on par with the Apple A13 SoC. Single thread, however is still a strong suit of the Apple SoCs.

Compared to the previous generations, the Snapdragon 865 does not integrate an LTE modem anymore, but has to be paired with the new X55 5G modem, that also supports LTE Cat 24/22. The Wi-Fi module however is still integrated and called FastConnect 6800 with support for Wi-Fi 6 (802.11ax) and 8x8 MU-MIMU and 60 GHz 802.11ay with up to 10 Gbps. Bluetooth 5.1 is also supported including aptX Adaptive.

The integrated GPU is now called Adreno 650 and should offer 20% more performance than the Adreno 640 in the Snapdragon 855.

The on board Hexagon 698 DSP now offers an improved KI performance of up to 15 TOPS (up from 7 TOPS in the 855) and still uses a combination of CPU, GPU, HVX and Tensor cores. The Spectra 480 ISP is now also significantly faster. The integrated Computer Vision Engine (CV-ISP) now supports Dolby Vision, 8K videos and 200 megapixel photos.

The built-in memory controller now supports LPDDR5 with up to 2,750 MHz and LPDDR4X with 2,133 MHz.

The Snapdragon 865 is manufactured at TSMC in the new improved 7nm process (N7P, DUV-based). The process offers a 7% higher performance or 10% less power consumption compared to the old N7 process.

MediaTek Dimensity 7030

The Mediatek Dimensity 7030 is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC was introduced in September 2023.

It includes a 5G modem and supports the latest mobile phone standards in dual-SIM mode with both cards, so that surfing and phoning is possible via two different cards at the same time. The SoC integrates two ARM Cortex A78 cores with up to 2.5 GHz for demanding tasks and six low-power ARM Cortex A55 cores with clock speeds of up to 2 GHz.

The chip has an integrated sub-6 GHz and mmWave 5G modem including dual-SIM support that can reach a maximum download speed of up to 4.6 Gbps. Wi-Fi 6E (802.11ax) is supported as well as Bluetooth 5.2. 

The memory controller can cope with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the Mali-G610 MP3, which supports displays with 144 Hz as well as HDR10+ Adaptive, HLG and Dolby Vision at a maximum resolution of 2,520 x 1,080 pixels.

Compared to the Dimensity 920, the CPU unit has the same clock speeds but a more modern instruction set, ARMv8.2-A. A new graphics unit is used and WiFi 6E is supported, as well as displays with up to 144 Hz.

The SoC is manufactured in a 6nm process.