MediaTek Dimensity 7300 vs Qualcomm Snapdragon 765 vs MediaTek Dimensity 8200-Ultra

MediaTek Dimensity 7300

The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.

In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.

The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.

Qualcomm Snapdragon 765

The Qualcomm Snapdragon 765 (SD765 Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core, called Kryo 475) divided into two clusters. A fast performance cluster contains two ARM Cortex-A76 cores clocked at up to 2.3 GHz (prime core) and 2.2 GHz (gold core) and a power efficiency cluster with six small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds.

Compared to the gaming optimized Snapdragon 765G, the 765 offers -100 MHz less clock speed on the prime core and a lower clocked GPU.

The processor performance is quite comparable to the old Snapdragon 730G. Only the single core performance can be slightly better, thanks to the higher clocked prime core.

The chip is one of the first SoCs that integrate a 5G modem. It is called Snapdragon X52 and supports speeds of up to 3.7 / 1.6 Mbps (down- and upload) and mmWave and Sub-6.

The integrated Adreno 620 offers a 16.7% lower performance than the same GPU in the SD 768G and also misses some of the softare gaming features.

The integrated AI engine uses the GPU, CPU and dedicated cores to reach a theoretical maximum performance of approx. 5.5 TOPS (value from the slightly faster SD 768G).

The processor is manufactured in the modern and energy efficient 7nm EUV process at Samsung. 

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.