AMD Raphael turns up in new renders with an unusual IHS design
The chipsets that might become known as the Ryzen 7000 series (or, possibly, AMD Raphael for now) are, by all accounts, still a long way off succeeding the current 5000 line. Nevertheless, leaks purporting to shed light on the processors' design, architecture and potential power have arised already.
Raphael is, for example, projected to switch to land grid array (LGA) rather than the pin grid array (PGA) of current AMD solutions, and to bring the advanced 5 nanometer (nm) process to the Zen line. However, its latest leak focuses on a more macroscopic aspect of the "7000" construction: its integrated heat spreader (IHS).
It consists of renders posted by the tipster @ExecutableFix, and in fact elaborates on earlier work showing a distinctive, raised IHS with 2 prominent cut-outs to a side. They were originally depicted as being completely vacant; however, the newer images populate each of these indentations with as many as 8 capacitors each.
The new leak may thus (obviously) point to improved inbuilt thermal-management in the Raphael series. On the other hand, this new IHS shape does come across as an impending headache for modders, not to mention repair as well. In any case, it may, again, be some time before these rumors are proven true.