Google Tensor G2 vs Qualcomm Snapdragon 888 5G vs MediaTek Dimensity 8200-Ultra

Google Tensor G2

The Google Tensor G2 SoC is a chip that was developed by Google and Samsung for the Google Pixel smarthpones. It is the successor to the Google Tensor G1 and still integrates the same CPU cores. This processor part includes two fast ARM Cortex-X1 cores at up to 2.85 GHz (up from 2.8 GHz of the G1), two mid-range Cortex-A78 cores at up to 2.35 GHz and four small ARM Cortex-A55 efficiency cores with up to 1.8 GHz. The caches are identical with 4 MB CPU L3 cache and 8 MB system level cache. Therefore, the CPU performance is very similar to the first generation of the Tensor SoC.

A big upgrade is the new TPU, which should be more powerful and power efficient compared to its predecessor. In our tests, the AI performance is about 50% higher.

The iGPU was also improved, and now uses a more modern ARM Mali G710 architecture with 7 cores.

The chip also integrates a Titan M2 security processor, a LPDDR5 memory controller, and an ISP for 10-bit HDR / 4k/60 video and 108 MP cameras.

The SoC is manufactured in 5nm at Samsung.

Qualcomm Snapdragon 888 5G

The Qualcomm Snapdragon 888 5G Mobile Platform is a high-end SoC for smartphones that was introduced in late 2020 and manufactured in 5 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.

The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).

MediaTek Dimensity 8200-Ultra

The MediaTek Dimensity 8200-Ultra is a upper mid-range ARM-based SoC (system-on-a-chip) that is manufactured using the modern 4 nm process. It was specially designed for use in Android smartphones and is in the upper class in terms of performance. It supports all current mobile communication standards, including 5G SA. 

The CPU works with a total of eight cores, which are divided into two clusters. In the first cluster, an ARM Cortex-A78 power core clocked at 3.1 GHz is joined by three further ARM Cortex-A78 power cores clocked at 3 GHz. In the second cluster, four ARM Cortex-A55 power cores operate at 2.0 GHz. LPDDR5 RAM can be used as RAM and UFS 3.1 is supported as internal memory. 

In terms of connectivity, dual 5G with a theoretical peak download speed of up to 4.7 GBit/s is available, as well as WiFi 6E and Bluetooth 5.3.

The Mediatek Dimensity 8200-Ultra is a variant of the otherwise identical Mediatek Dimensity 8200 that has been specially customised for Xiaomi and features improvements to the camera ISP. An Imagiq 785 image processor is responsible for processing the camera data. Video recordings are supported with up to 4K at 60 fps. The CPU part of the older Dimensity 8100 is very similar and offers the same CPU and GPU cores.

The integrated ARM Mali-G610 MC6 graphics unit can power displays with a resolution of up to 2,960 x 1,440 pixels (WQHD+) and a refresh rate of up to 120 Hz. With Full HD+, even up to 180 Hz is possible.