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TEAMGROUP launches the "world's first" vapor-chamber liquid-cooled SSD for industrial-grade computing

Teaser
TEAMGROUP's latest PCIe M.2 SSD is pitched at high-performance, highly-demanding use-cases, yet is touted to stand out from this industrial crowd with a first-gen vapor chamber- (VC) equipped tube system. It incorporates in-house liquid cooling touted to keep the SSD running at full speed even in ambient temperatures as high as 85°C.

TEAMGROUP concedes that it has been inspired by the leaps and bounds made in cooling for mobile devices in designing the new thermal-management module for its latest SSD. Nevertheless, the N74V-M80 is aimed squarely at HPC clients with the servers, research centers or AI concerns that might need their components to keep running at optimal capacity in challenging circumstances.

Accordingly, TEAMGROUP asserts that its new "VC liquid cooling" for SSDs - for which it holds the patent in Taiwan - can keep the N74V-M80 cool in conditions ranging from -40°C (-40°F) to 85°C (185°F). Its tubes shunt excess thermal energy away from its PCIe controller to the aluminum fins of the drive's heat-sink via convection.

TEAMGROUP claims that their combination can maintain write speeds more efficiently than an SSD without a heat-sink at its max operating temperature. On that note, the N74V-M80 uses TLC flash modules, as well as the PCIe Gen3 x4 and NVMe 1.3 standards to achieve maximal write speeds of up to 3,400 megabytes per second (MB/s) and read-speeds of up to 2,500MB/s.

The TEAMGROUP N74V-M80 will be available in just 1 colorway (black), although the OEM has yet to say where it will be sold or for how much as yet.

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The new TEAMGROUP SSD has both a liquid-cooling system and a heat-sink. (Source: TEAMGROUP)
The new TEAMGROUP SSD has both a liquid-cooling system and a heat-sink. (Source: TEAMGROUP)

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> Expert Reviews and News on Laptops, Smartphones and Tech Innovations > News > News Archive > Newsarchive 2022 07 > TEAMGROUP launches the "world's first" vapor-chamber liquid-cooled SSD for industrial-grade computing
Deirdre O'Donnell, 2022-07-30 (Update: 2022-07-30)