Infinix touts its 3D Vapour Cloud Chamber Liquid Cooling Technology as an improved solution for the smartphones of the future

Vapor chambers have been mobile quite a number of years ago now, introduced to smartphones as their increasingly powerful processors demand more and more thermal management by the generation.

They are somewhat intuitive additions to this form-factor, usually consisting of thin sandwiches of material (typically copper or even steel) containing tiny droplets of moisture rated to evaporate in the presence of heat, migrate away to a cooler location, condense again and repeat the cycle if necessary.

This rationale works fairly well for smartphones; (as part of a full system involving the inevitable strata of buzzwordy layers intended to ward off overheating, of course) on the other hand, they have their limits, chief among which is the surface area currently being maxed out by multiple OEMs at this point.

Infinix has reportedly addressed this issue with the development of 3D Vapour Cloud Chamber (or 3D VCC) Liquid Cooling Technology, a new kind of VC with a raised impression that seems to correspond to the SoC in question.

Not only is this large shallow divot rated to increase the surface area available to the VC again, it also brings its exterior physically closer to said processor, thereby apparently increasing thermal conductivity and reducing thermal resistance in that region.

Infinix also asserts that its new breakthrough also raises general VC performance through the choice of new and optimized alloys, put together using an "advanced welding technique".

All in all, 3D VCC is backed to get dissipating with 12.5% reduced latency, and to bring overall temperatures down by an additional 3°C, compared to last-gen VCs. Infinix has yet to unveil a smartphone with this new technology, although the upcoming 180W ThunderCharge flagship is as good a candidate as any.