Qualcomm Snapdragon 888 5G vs MediaTek Dimensity 7050 vs Qualcomm Snapdragon G3x Gen 1

Qualcomm Snapdragon 888 5G

The Qualcomm Snapdragon 888 5G Mobile Platform is a high-end SoC for smartphones that was introduced in late 2020 and manufactured in 5 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.

The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).

MediaTek Dimensity 7050

The Mediatek Dimensity 7050 (Mediatek MT8791N/TN)  is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC integrates two ARM Cortex-A78 cores with up to 2.6 GHz for demanding tasks and six power-saving ARM Cortex-A55 cores with clock rates of up to 2 GHz. The specifications are identical to the old Dimensity 1080.

The chip has an integrated sub-6 GHz 5G modem including dual-SIM support that can reach a maximum download speed of up to 2.77 Gbit/s. Wi-Fi 6 (802.11ax) is supported as well as Bluetooth 5.2.

The memory controller copes with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the ARM Mali-G68 MC4, which supports displays with 120 Hz as well as HDR10+ at a maximum resolution of 2,520 x 1,440 pixels.

The MediaTek Dimensity 7050 is still manufactured in 6 nm.

Qualcomm Snapdragon G3x Gen 1

The Qualcomm Snapdragon G3x Gen 1 (model number: SG8175P) is a revised version of the Snapdragon 888+ 5Gwhich is intended for use in Android-based gaming handhelds and tablets.

The SoC (system-on-a-chip) integrates a fast ARM Cortex-X1-based "Kryo 680 Prime Core" with up to 3.00 GHz and three additional fast Kryo 680 Gold performance cores (Cortex-A78-based) with up to 2.42 GHz. To save power, four additional Kyro 680 Silver (ARM Cortex-A55 based) cores have also been integrated, which operate at up to 1.8 GHz. An Adreno 660 is responsible for graphics acceleration.

The integrated Snapdragon X60 5G modem enables download speeds of up to 7.5 Gbit/s and upload speeds of up to 3 Gbit/s and supports DSS, mmWave and Sub6. The integrated FastConnect 6900 Wi-Fi modem supports all common standards, including Wi-Fi 6E with 6 GHz. Bluetooth version 5.2 is on board.

The SoC is manufactured using the 5 nm EUV process.