Qualcomm Snapdragon 710 vs HiSilicon Kirin 960 vs HiSilicon Kirin 710

Qualcomm Snapdragon 710

The Qualcomm Snapdragon 710 (SD710) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. Announced in early 2018, the SD710 is the first of the 700 series and positions itself between the 600 series (e.g. Snapdragon 660) and 800 series (e.g. Snapdragon 845). It integrates 8 Kryo 360 cores devided in two big cores (most likely based on Cortex-A75 at up to 2.2 GHz) and six small cores (most likely based on Coretx-A55 at up to 1.7 GHz). The memory controller supports LPDDR4X and the integrated graphics card is called Adreno 616. The X15 LTE modem supports 4x4 MIMO with up to 800 MBbit/s download and 150 MBit/s upload.

Compared to the older Snapdragon 660, Qualcomm advertises the CPU clusters to be up to 20% faster and the GPU up to 35 %.

The Snapdragon 710 is manufactured in the modern 10 nm process at Samsung (10LPP).

HiSilicon Kirin 960

The HiSilicon Kirin 960 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 9 in November 2016. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G71 MP8 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE Cat. 12/13 modem. It is one of the fastest ARM SoCs in the end of 2016. The Kirin 960 is manufactured in a modern 16-nm process at TSMC.

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).