Qualcomm Snapdragon 695 5G vs MediaTek Dimensity 700 vs MediaTek Dimensity 720

Qualcomm Snapdragon 695 5G

The Qualcomm Snapdragon 695 5G (SD695) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 660 called cores (64-Bit capable) that are divided in two clusters. A fast cluster of two cores with up to 2.2 GHz based on the ARM Cortex-A78 design. And a power saving efficiency cluster with up to 1.7 GHz based on much smaller ARM Cortex-A55 cores. Both clusters can also used together. The successor of the SD695 is the Snapdragon 6s Gen 3 with slightly higher clocked cores.

In addition to the 8 CPU cores, the SoC integrates a lower mid range Adreno 619 GPU, a X51 5G radio (up to 2.5 Gbits download, no mmWave), a 802.11ac (Wi-Fi 5, 8x8 sounding, Dual Band, 2x2), a Bluetooth 5.2 radio, satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou and Galileo) and a video engine (support for H.265, H.264, VP8 and VP9).

Compared to the previous SD690, the SD695 is now manufactured in 6nm (instead of 8nm) and offers a higher clocked performance cluster. However, the SD695 only supports Wi-Fi 5 instead of Wi-Fi 6 of the SD690.

MediaTek Dimensity 700

The Mediatek Dimensity 700 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Compared to the similar Dimensity 800U, the 700 offers lower clocked CPU cores (-200 MHz) and a slower GPU (one less core).

Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x-2133 memory controller, a AI processing unit (APU 3.0) and video de- and encoding.

The Dimensity 700 is manufactured in the modern 7nm process and should be very power efficient.

MediaTek Dimensity 720

The Mediatek Dimensity 720 is a mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores and four power efficient Cortex-A55 cores, all clocked at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU) and video de- and encoding. Compared to the faster Dimensity 820, the CPU cores are lower clocked and the GPU offers less cores. Furthermore, all other features were slightly restricted (e.g. max. 12 GB RAM).

The Dimensity 720 is manufactured in the modern 7nm process and should be very power efficient.