Qualcomm offers a sneak peek at the Snapdragon 865 and Snapdragon 765/765G Mobile Platforms with integrated 5G

Let us come to the first communicated information about the new Snapdragon chips 865 and 765/765G. Qualcomm is the first manufacturer to integrate a 5G multimode modem (5G and LTE) directly into the 765G chip, supporting both frequencies below 6 GHz and mmWave.

In the case of the flagship SoC Snapdragon 865, the integration of the modem has been dispensed with, in contrast to the previous high-end SoC Snapdragon 855. The Snapdragon X55 5G modem must be specially combined with the 865 chip by the respective manufacturer. Reasons for this have not yet been explained, but the complexity of 5G on the one hand, and the high performance requirements of the 865 processor (thermal management) on the other hand, may not have allowed a fusion of the two parts at this point in time. Qualcomm speaks of 15 TOPS for the performance of the Snapdragon 865, double the previous Snapdragon version (855). A comparison of the two CPU packages shows that, despite the lack of a modem in the Snapdragon 865, both are about the same size.

Consumers buy a camera phone not just a phone. (Christiano Amon, President Qualcomm Inc.)

Special attention was also paid to the camera functions. The integrated Image Signal Processor (ISP) should be able to process gigantic 2 gigapixels per second. This will enable a recording rate of 8K 30fps, with 64 megapixels available for each video image. In addition to "desktop features into mobile gaming", but without going into details, "sustained performance" with CPU and GPU, i.e. no throttling even with sustained high power output, was announced. Qualcomm also announces a novelty in fingerprint sensor technology: 3D Sonic Max works with a significantly larger sensor range, allowing two fingers to be scanned simultaneously.