HiSilicon Kirin 970 vs HiSilicon Kirin 990 vs HiSilicon Kirin 810

HiSilicon Kirin 970

The HiSilicon Kirin 970 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 10 in late 2017. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G72 MP12 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE (4x4 MIMO, 5-band-carrier-aggregation, QAM-256, up to 1.2 Gbit/s) modem.

The performance cluster is clocked at up to 2.4 GHz and the four A53 power saving cores with up to 1.8 GHz. The performance should improve by about 20 percent according to Huawei and the power consumption reduced by 20 percent.

On the chip HiSilicon also included a dedicated Neural Processing Unit (NPU) for running machine learning tasks very efficiently compared to the CPU cores.

HiSilicon Kirin 990

The HiSilicon Kirin 990 4G is an ARM based high-end octa-core SoC for smartphones and tablets, which was introduced with the Huawei Mate 30 Pro in late 2019. It integrates eight CPU cores in three clusters. The performance cluster contains two Cortex-A76 cores with up to 2.86 GHz, the balanced cluster contains also two Cortex-A76 cores but with only up to 2.09 GHz and finally the power saving cluster contains four small ARM Cortex-A55 cores with up to 1.86 GHz. Furthermore, the SoC integrates a neural processor (1 + 1 cores) for AI tasks and a ARM Mali-G76 MP16 GPU clcoked at up to 600 MHz. Compared to the 5G version, the 4G Kirin 990 integrates a fast 4G modem and is slightly lower clocked (2 of the 3 clusters and the GPU).

The Kirin 990 is produced in the modern 7nm process at TSMC.

HiSilicon Kirin 810

The HiSilicon Kirin 810 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2019 and contains 8 processor cores. Two fast ARM Cortex-A76 cores with up to 2.27 GHz and six small power efficient ARM Cortex-A55 cores with up to 1.88 GHz (bigLITTLE). Furthermore, the SoC integrates a mid range graphics card called ARM Mali-G52 MP6 with 6 clusters. For AI acceleration, the Kirin 810 integrates a Ascend D100 Lite NPU (Da Vinci architecture). The integrates LTE modem supports Cat.12/13 with Dual Sim VoLTE. For photography, the Kirin 810 integrates the Kirin ISP4.0. The memory controller supports LPDDR4X at up to 2133 MHz. Furthermore, WiFi 802.11ac and Bluetooth 5.0 are integrated in the chip.

The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.