HiSilicon Kirin 970 vs HiSilicon Kirin 820 vs HiSilicon Kirin 810

HiSilicon Kirin 970

The HiSilicon Kirin 970 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 10 in late 2017. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G72 MP12 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE (4x4 MIMO, 5-band-carrier-aggregation, QAM-256, up to 1.2 Gbit/s) modem.

The performance cluster is clocked at up to 2.4 GHz and the four A53 power saving cores with up to 1.8 GHz. The performance should improve by about 20 percent according to Huawei and the power consumption reduced by 20 percent.

On the chip HiSilicon also included a dedicated Neural Processing Unit (NPU) for running machine learning tasks very efficiently compared to the CPU cores.

HiSilicon Kirin 820

The HiSilicon Kirin 820 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2020 and contains 8 processor cores. One fast ARM Cortex-A76 core with up to 2.36 GHz, three addition A76 cores at up to 2.22 (as the old Kirin 810) and four efficiency Cortex-A55 cores at up to 1.88 GHz. Furthermore, the SoC integrates a 5G modem and a fast mid-range ARM Mali-G57 MP6 graphics card. For AI acceleration, the Kirin 820 integrates a DaVinci NPU.

The performance of the CPU part in our tests was slightly higher than the old Kirin 810 (thanks to the fast performance core). Huawei advertises 27% performance advantage for the CPU. The NPU and GPU have bigger performance gains with 73% and 38% more power.

The chip should also integrate Bluetooth 5 and WiFi 6.

The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.

HiSilicon Kirin 810

The HiSilicon Kirin 810 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2019 and contains 8 processor cores. Two fast ARM Cortex-A76 cores with up to 2.27 GHz and six small power efficient ARM Cortex-A55 cores with up to 1.88 GHz (bigLITTLE). Furthermore, the SoC integrates a mid range graphics card called ARM Mali-G52 MP6 with 6 clusters. For AI acceleration, the Kirin 810 integrates a Ascend D100 Lite NPU (Da Vinci architecture). The integrates LTE modem supports Cat.12/13 with Dual Sim VoLTE. For photography, the Kirin 810 integrates the Kirin ISP4.0. The memory controller supports LPDDR4X at up to 2133 MHz. Furthermore, WiFi 802.11ac and Bluetooth 5.0 are integrated in the chip.

The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.