The HiSilicon Kirin 970 is an ARM based high-end octa-core SoC for smartphones and tablet, which was introduced with the Huawei Mate 10 in late 2017. Besides 8 CPU cores (4x Cortex-A73, 4x Cortex-A53), the SoC is also equipped with a modern Mali-G72 MP12 graphics adapter, a dual-channel LPDDR4 memory controller as well as an LTE (4x4 MIMO, 5-band-carrier-aggregation, QAM-256, up to 1.2 Gbit/s) modem.
The performance cluster is clocked at up to 2.4 GHz and the four A53 power saving cores with up to 1.8 GHz. The performance should improve by about 20 percent according to Huawei and the power consumption reduced by 20 percent.
On the chip HiSilicon also included a dedicated Neural Processing Unit (NPU) for running machine learning tasks very efficiently compared to the CPU cores.
The Mediatek Dimensity 810 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A76 cores at up to 2.4 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 2 core ARM Mali-G57 MC2 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller(up to 16 GB with 2133 MHz), a AI processing unit (APU 3.0) and video de- and encoding.
The integrated 5G modem supports dual-5G (Sub6) with up to 2.77 GBit/s download.
The Dimensity 800 is manufactured in the modern 6nm process at TSMC and should be very power efficient.
The MediaTek Dimensity 6080 (MT6833V/MT6833GP) is an ARM-based SoC (system-on-a-chip) manufactured by TSMC using the 6 nm process. It was specially designed for use in Android smartphones and is in the lower mid-range in terms of performance. It supports all current mobile communication standards, including 5G Sub6.
The SoC is identical to the MediaTek Dimensity 810 the only difference is that the Dimensity 6080 can cope with a camera resolution of up to 108 megapixels.
The CPU works with a total of eight cores, which are divided into two clusters. One has two ARM Cortex-A76 power cores with up to 2.4 GHz each, while the other has six ARM Cortex-A55 energy-saving cores with up to 2.0 GHz each. LPDDR4x RAM with 2,133 MHz can be used as RAM and UFS 2.2 is supported as internal memory.
In terms of connectivity, dual 5G (Sub6) with a theoretical peak download speed of up to 2.77 GBit/s is available, as well as Wi-Fi 5 and Bluetooth 5.1.
The integrated graphics unit ARM Mali-G57 MP2 can power displays with a resolution of up to 2,520 x 1,080 pixels (Full HD+) and a refresh rate of up to 120 Hz.
8 / 8 2 x 2.4 GHz ARM Cortex-A76 6 x 2.0 GHz ARM Cortex-A55
Transistors
5500 Million
Technology
10 nm
6 nm
6 nm
Features
ARM Mali-G71 MP12 GPU, 4x Cortex-A73 (2.4 GHz) + 4x Cortex-A53 (1.8 GHz, big.LITTLE), 2x LTE Dual-SIM (4x4-MIMO, QAM-256, up to 1,2 Gbit/s)
2x ARM Cortex-A76 (2.4 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G57 MP2, Wi-Fi 5, Bluetooth 5.1, UFS 2.2, LPDDR4x Support; SA & NSA modes; SA Option2, NSA Option3 / 3a / 3x, NR TDD Band, NR FDD Band, DSS, NR DL 2CC, 120 MHz bandwidth, 256QAM NR UL 2CC,
Average Benchmarks MediaTek Dimensity 810 → 129%n=4
Average Benchmarks MediaTek Dimensity 6080 → 148%n=4
- Range of benchmark values for this graphics card - Average benchmark values for this graphics card * Smaller numbers mean a higher performance 1 This benchmark is not used for the average calculation
v1.27
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