HiSilicon Kirin 810 vs Samsung Exynos 9609

HiSilicon Kirin 810

The HiSilicon Kirin 810 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2019 and contains 8 processor cores. Two fast ARM Cortex-A76 cores with up to 2.27 GHz and six small power efficient ARM Cortex-A55 cores with up to 1.88 GHz (bigLITTLE). Furthermore, the SoC integrates a mid range graphics card called ARM Mali-G52 MP6 with 6 clusters. For AI acceleration, the Kirin 810 integrates a Ascend D100 Lite NPU (Da Vinci architecture). The integrates LTE modem supports Cat.12/13 with Dual Sim VoLTE. For photography, the Kirin 810 integrates the Kirin ISP4.0. The memory controller supports LPDDR4X at up to 2133 MHz. Furthermore, WiFi 802.11ac and Bluetooth 5.0 are integrated in the chip.

The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.

Samsung Exynos 9609

The Samsung Exynos 9609 (or Exynos 7 Series 9609) is a mid-range SoC for Android based smartphones and tablets. It integrates 8 processor cores in two clusters (big.LITTLE concept). Four ARM Cortex A73 cores at up to 2.2 GHz for demanding tasks and four ARM Cortex A53 at up to 1.6 GHz for power efficiency. Compared to the older Exynos 9610, the 9609 offers 100 MHz less clock speed for both clusters.

The integrated LTE modem supports 4G at up to 600 Mbps download and 150 Mbps upload. Furthermore, 802.11ac WiFi and Bluetooth 5.0 are also integrated in the chip.

The on-board ARM Mali-G72 MP3 graphics card offers three clusters and support for Vulkan, DirectX 12 and OpenGL ES 3.2.

The Exynos 9609 is manufactured in the modern 10nm FinFET process and therefore relatively power efficient and also suited for smaller smartphones.