Notebookcheck Logo

Intel and Micron unveil 3D XPoint memory chips

3D XPoint technology wafers by Intel
3D XPoint wafers
This is the first new memory category in 25 years and brings non-volatile memory speeds up to 1,000 times faster than NAND.

Intel and Micron announced earlier today the introduction of the first new memory category in over 25 years. Dubbed 3D XPoint, this new class of non-volatile memory promises to be 1,000 times faster than NAND, which is currently the most popular technology used today for non-volatile memory chips and was introduced back in 1989. Even better, 3D XPoint also promises up to 1,000 times the endurance of its predecessor.

According to the official press release, Intel and Micron "invented unique material compounds and a cross point architecture," the result being a technology that allows chips 10 times denser than conventional ones. 3D XPoint promises to bring a wide range of innovations from theory to practice, including real-time tracking of diseases and machine learning, as well as 8K gaming.

First batches of 3D XPoint memory chips are already in production and samples will reach select customers later this year. Both Intel and Micron are also working on individual products that use this technology. For more details, please check the press release below.

+ Show Press Release
static version load dynamic
Loading Comments
Comment on this article
Please share our article, every link counts!
Codrut Nistor, 2015-07-28 (Update: 2015-07-28)