Intel and Micron launch new 3D NAND flash memory
The race for better storage solutions continues as Micron and Intel unveil new 3D NAND technology that takes flash storage to a whole new level. According to the official press release, the new chip uses floating-gate cells and provides three times more storage space than other NAND die currently available.
The new technology "enables more storage in a smaller space, bringing significant cost savings, low power usage and high performance to a range of mobile consumer devices as well as the most demanding enterprise deployments." These are the highlights of the new 3D NAND design by Intel and Micron:
- large capacity - up to 48 GB per die
- lower cost per GB - better cost than planar NAND
- high performance
- eco-friendly - significantly lower consumption while in standby
- increased endurance
Since the 256 GB MLC version is already sampling with select partners and the 384 GB variant will follow later this spring, the first products that use it may become available this winter holiday season. Unfortunately, SSD products based on this new technology will only be ready "within the next year."
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