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SK Hynix develops 72-layer 3D NAND flash chip

Toshiba BG1 NVMe SSD with TLC 3D NAND flash memory chips
Toshiba BG1 NVMe SSD TLC 3D NAND
The new technology allows SK Hynix to manufacture chips with a capacity of 32 GB, pushing the South Korean chip maker past Samsung and Toshiba, both still unable to supply 72-layer 3D NAND flash memory.

SK Hynix has just managed to leave behind Samsung Electronics and Toshiba and became the first flash memory maker to develop a 72-layer 256 Gigabit TLC 3D NAND chip. Its two rivals are still in the 64-layer area, Samsung shipping such chips already, while Toshiba still has to begin shipments.

According to Hynix, the new chips "have 30 percent higher production rate compared to the 48-layer and stacks 1.5 more cells to increase memory capacity. Reading and writing speeds are 20 percent higher." The company moved fast since last year, when they introduced 36-layer 128 Gigabit 3D NAND in the second half, followed by 48-layer 256 Gigabit in November.

The new technology allows Hynix to improve the storage solutions offered to new handsets and solid state drives, also helping the company to remain a key player in this market. Research firm Gartner thinks that 3D NAND usage will reach the 66 percent mark in 2018, up from less than 19 percent last year. The entire NAND flash market is estimated to jump from around $46.5 billion this year all the way up to $56.5 billion by 2021.

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> Notebook / Laptop Reviews and News > News > News Archive > Newsarchive 2017 04 > SK Hynix develops 72-layer 3D NAND flash chip
Codrut Nistor, 2017-04-10 (Update: 2018-11- 6)
Codrut Nistor
Codrut Nistor - News Editor
Although I have been writing about new software and hardware for almost a decade, I consider myself to be old school. I always enjoy listening to music on CD or tape instead of digital files and I will not even get into the touchscreen vs physical keys debate. However, I also enjoy new technology, as I now have the chance to take a look at the future every day. I joined the Notebookcheck crew back in 2013 and I have no plans to leave the ship anytime soon.