Mediatek Helio P65 vs Qualcomm Snapdragon 675 vs Mediatek Helio G70

Mediatek Helio P65

The Mediatek Helio P65 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in mid 2019. It is manufactured in a 12 nm FinFET (12FFC) process and is equipped with 2x big ARM Cortex-A75 cores with up to 2 GHz and 6x small and power efficient ARM Cortex-A55 cores in two clusters (bigLITTLE). The processor also integrates a ARM Mali-G52MC2 GPU and a dedicated AI processing unit. Furthermore, the integrated radio supports Cat-7 (DL) / Cat-13 (UL) LTE, 802.11ac, Bluetooth 4.2, and FM radio.

Qualcomm Snapdragon 675

The Qualcomm Snapdragon 675 (SD675) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It features 8 Kryo 460 called cores (64-Bit capable) that are divided in two clusters. A fast cluster of two cores with up to 2 GHz and  based on the ARM Cortex-A76 design. And a power saving efficiency cluster with up to 1.6 GHz and based on much smaller ARM Cortex-A55 cores. Both clusters can also used together.

In addition to the 8 CPU cores, the SoC integrates a lower mid range Adreno 612 GPU, a X12 LTE Modem with up to 600 Mbps download (Cat 12) and 150 Mbps upload (Cat 13), a 802.11ac (Wifi 5) Wave 2 WLAN modem (up to 867 Mbps), a Bluetooth 5.0 radio, satellite positioning (GPS, QZSS, GLONASS, SBAS, Beidou and Galileo) and a video engine (up to 4k30 encoding and support for H.265, H.264, VP8 and VP9).

Performance

Thanks to the two fast Cortex-A76 based cores, the SD675 is able to even best the old high end Snapdragon 835 SoC in some benchmarks. The less powerful Snapdragon 670 e.g. only achieves 70 to 77% of the performance in Geekbench 4.3 (single - multi core test). Current high-end SoCs like the Snapdragon 855 however can still add 50-70% on top of the performance of the 675.

The Snapdragon 675 is produced in the new 11nm LPP (Low Power Plus) process at Samsung which is a combination of 14nm and 10nm. Compared to 14nm LPP, the 11nm LPP process should be able to increase performance by 15% and decrease the chip size by 10% according to Samsung.

Mediatek Helio G70

The Mediatek Helio G70 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.7 GHz for efficiency. All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 820 MHz. The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory.

Compared to the slightly faster Helio G80, the difference to the G70 is the slightly lower clock speed for the A55 cores (-100 MHz) and GPU (-130 MHz).

The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.