Samsung Exynos 1380 vs MediaTek Dimensity 7300 vs MediaTek Dimensity 8100
Samsung Exynos 1380
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The Samsung Exynos 1380 is a system on a chip (SoC) designed for mid-range smartphones and tablets running on the Android operating system. The CPU is made up of two clusters, each consisting of four cores. It features four Cortex-A78 performance cores (up to 2.4 GHz) and four Cortex-A55 power-saving cores (up to 2.0 GHz). The integrated graphics unit is an ARM Mali-G68 MP5 with speeds of up to 950 MHz.
The NPU's performance has been improved by around 14 percent compared to its predecessor, with a capacity of 4.9 TOPS. Displays with up to 144 Hz and Full HD+ resolution can now be used, and the chipset supports cameras with up to 200 MPix. The chipset also includes Wi-Fi 6 and Bluetooth 5.3. Both LPDDR4x and LPDDR5 can be used as RAM, and UFS 3.1 is possible as internal storage.
The integrated modem has significantly increased download speeds, supporting both 5G-Sub6 (download: up to 3.79 Gbps (+32%), upload: up to 1.28 Gbps) and 5G-mmWave (download: up to 3.67 Gbps (+75%), upload: up to 0.92 Gbps). The upload speed for LTE (Cat. 18, download: up to 1.2 Gbps, upload: up to 0.211 Gbps (+5%)) has only been slightly improved.
The Exynos 1380 is manufactured by Samsung using the 5-nm process.
MediaTek Dimensity 7300
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The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
MediaTek Dimensity 8100
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The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.
The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).
The chip is produced at TSMC in 5nm.
| Model | Samsung Exynos 1380 | MediaTek Dimensity 7300 | MediaTek Dimensity 8100 | ||||||||||||
| Codename | ARM Cortex-A55 / A78 | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||||||
| Series | Samsung Exynos | ||||||||||||||
| Series: Exynos ARM Cortex-A55 / A78 |
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| Clock | 2000 - 2400 MHz | 2000 - 2500 MHz | 2000 - 2850 MHz | ||||||||||||
| Cores / Threads | 8 / 8 4 x 2.4 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 4 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | ||||||||||||
| Technology | 5 nm | 4 nm | 6 nm | ||||||||||||
| Features | NPU, Wi-Fi 802.11ax (2x2 MIMO), Bluetooth 5.3, FM Radio Rx, GNSS (GPS, Glonass, BeiDou, Galileo), Triple-ISP | 4x ARM Cortex-A77 (2.85 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G610 MC6, APU 580, 5G Modem, MiraVision 780, Wi-Fi 6E, Bluetooth 5.3, UFS 3.1, LPDDR5 | |||||||||||||
| iGPU | ARM Mali-G68 MP5 ( - 950 MHz) | ARM Mali-G615 MP2 | ARM Mali-G610 MP6 | ||||||||||||
| Architecture | ARM | ARM | ARM | ||||||||||||
| Announced | |||||||||||||||
| Manufacturer | semiconductor.samsung.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Samsung Exynos 1380 → 100% n=16
Average Benchmarks MediaTek Dimensity 7300 → 117% n=16
Average Benchmarks MediaTek Dimensity 8100 → 142% n=16
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
