MediaTek Dimensity 8050 vs Qualcomm Snapdragon 888 5G vs MediaTek Dimensity 7050
MediaTek Dimensity 8050
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The MediaTek Dimensity 8050 is an ARM-based SoC (System-on-a-Chip) manufactured at TSMC using the 6nm process. It supports all current mobile standards including dual-SIM 5G (5G SA & NSA, max 4.7 Gbps download and 2.5 Gbps upload). The SoC also supports Wi-Fi 6 and Bluetooth 5.2.
The MediaTek Dimensity 8050 was specially designed for use in Android smartphones and is classified in the upper mid-range in terms of performance.
The CPU part consists of three clusters: a fast performance core, based on the ARM Cortex A78 architecture and clocked at up to 3 GHz. The second cluster consists of three Cortex-A78 cores with up to 2.6 GHz. Four ARM Cortex-A55 cores with up to 2 GHz are installed as a power-saving cluster.
The integrated ARM Mali-G77 MC9 graphics unit can drive displays with a resolution of up to 2,560 x 1,080 and a refresh rate of up to 144 Hz (possibly only with Full HD+).
Technically, the SoC is similar to the older Dimensity 1300.
Qualcomm Snapdragon 888 5G
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The Qualcomm Snapdragon 888 5G Mobile Platform is a high-end SoC for smartphones that was introduced in late 2020 and manufactured in 5 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.
The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).
MediaTek Dimensity 7050
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The Mediatek Dimensity 7050 (Mediatek MT8791N/TN) is a mid-range ARM SoC (system-on-a-chip) that can be used in both smartphones and tablets (mainly Android). The SoC integrates two ARM Cortex-A78 cores with up to 2.6 GHz for demanding tasks and six power-saving ARM Cortex-A55 cores with clock rates of up to 2 GHz. The specifications are identical to the old Dimensity 1080.
The chip has an integrated sub-6 GHz 5G modem including dual-SIM support that can reach a maximum download speed of up to 2.77 Gbit/s. Wi-Fi 6 (802.11ax) is supported as well as Bluetooth 5.2.
The memory controller copes with LPDDR4x or LPDDR5 working memory as well as UFS 3.1 mass storage. As an integrated graphics card, the SoC uses the ARM Mali-G68 MC4, which supports displays with 120 Hz as well as HDR10+ at a maximum resolution of 2,520 x 1,440 pixels.
The MediaTek Dimensity 7050 is still manufactured in 6 nm.
Model | MediaTek Dimensity 8050 | Qualcomm Snapdragon 888 5G | MediaTek Dimensity 7050 | ||||||||||||||||
Codename | Cortex-A78 / A55 | Cortex-X1 / A78 / A55 (Kryo 680) | Cortex-A78 / A55 | ||||||||||||||||
Clock | 2000 - 3000 MHz | 1800 - 2840 MHz | 2000 - 2600 MHz | ||||||||||||||||
Cores / Threads | 8 / 8 1 x 3.0 GHz ARM Cortex-A78 3 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 1 x 2.8 GHz ARM Cortex-X1 3 x 2.4 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 | ||||||||||||||||
Technology | 6 nm | 5 nm | 6 nm | ||||||||||||||||
Features | 1x ARM Cortex-A77 (3 GHz), 3x ARM Cortex-A77 (2.6 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G77 MP9, APU 570, 5G Modem, MiraVision HDR10+, Wi-Fi 6, Bluetooth 5.2, UFS 3.1, LPDDR4x | Adreno 660 GPU, Spectra 580 ISP, Hexagon 780, X60 5G Modem, FastConnect 6900 WiFi,LPDDR5-6400 / LPDDR4X-4266 MHz Memory Controller (64 Bit) | 2x ARM Cortex-A78 (2.6 GHz), 6x ARM Cortex-A55 (2 GHz), ARM Mali-G68 MC4, 5G NR Sub-6 GHz, LTE | ||||||||||||||||
iGPU | ARM Mali-G77 MP9 | Qualcomm Adreno 660 | ARM Mali-G68 MP4 | ||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||
Announced | |||||||||||||||||||
Manufacturer | www.mediatek.com | www.qualcomm.com | www.mediatek.com | ||||||||||||||||
Series | Qualcomm Snapdragon | ||||||||||||||||||
Series: Snapdragon Cortex-X1 / A78 / A55 (Kryo 680) |
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L3 Cache | 3 MB | ||||||||||||||||||
TDP | 5 Watt | ||||||||||||||||||
Chip AI | 26 TOPS INT8 |
Benchmarks
Average Benchmarks MediaTek Dimensity 8050 → 100% n=14
Average Benchmarks Qualcomm Snapdragon 888 5G → 122% n=14
Average Benchmarks MediaTek Dimensity 7050 → 88% n=14

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation