Intel Core i7-13705H vs AMD Ryzen 7 H 260 vs AMD Ryzen 9 PRO 8945HS
Intel Core i7-13705H
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The Intel Core i7-13705H is a high-end mobile CPU for laptops based on the Raptor Lake-H series (Alder Lake architecture). It was announced in early 2023 and offers 6 performance cores (P-cores, Golden Cove architecture) and 8 efficient cores (E-cores, Gracemont architecture). The P-cores support Hyper-Threading leading to 20 supported threads when combined with the E-cores. The clock rate ranges from 2.4 to 5 GHz (single core turbo, all-core 4.7 GHz) on the performance cluster and 1.8 to 3.7 GHz on the efficiency cluster. The performance of the E-cores should be similar to old Skylake cores (compare with the Core i7-6920HQ). All cores can use up to 24 MB L3 cache. Similar to the i7-13700H but without vPro support and the 13705H uses a different package and socket.
Performance
Thanks to the high core count and high clock speed, the Core i7-13705H should be similar to the old top model, the Core i9-12900HK. Therefore, the CPU is very well suited for all demanding use cases like gaming, content creation, and scientific calculations. The performance should be identical to the Core i7-13700H.
Features
The integrated memory controller supports various memory types up to DDR5-5200 (up from 4800 MHz for the 12th gen). The Thread Director (in hardware) can support the operating system to decide which thread to use on the performance or efficient cores for the best performance. For AI tasks, the CPU also integrates GNA 3.0 and DL Boost (via AVX2). Quick Sync in version 8 is the same as in the Rocket Lake CPUs and supports MPEG-2, AVC, VC-1 decode, JPEG, VP8 decode, VP9, HEVC, and AV1 decode in hardware. The CPU now supports PCIe 5.0 x8 for a GPU and two PCIe 4.0 x4 for SSDs.
The integrated graphics card is based on the Xe-architecture and offers 96 EUs (Execution Units) clocked at up to 1.5 GHz.
The CPU is rated at 45 W base power (115 W PL2) but most laptops will use a PL1 of around 60 Watt. The SoC is manufactured in a 10nm process at Intel, which is known as Intel 7 (improved over the 12th Gen).
AMD Ryzen 7 H 260
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The AMD Ryzen 7 H 260 is a high-end notebook processor from the Hawk Point series with 8 cores and hyperthreading (SMT), which means it can process up to 16 threads simultaneously. At release, the CPU is only available in China and is technically practically identical to the older AMD Ryzen 7 8845HS or Ryzen 7 7840HS (slower AI engine).
The performance of the second-fastest model in the Hawk Point series should only be slightly behind the Ryzen 9 7940HS (+100 - 200 MHz clock, e.g. only 2% slower Turbo). As a result, the performance at 54W TDP should also be comparable to the AMD Ryzen 7 7745HX (also 8 Zen 4 cores, max 5.1 GHz, 55W, 32 MB L3) and thus clearly ahead of the old top model AMD Ryzen 9 6980HX resp. 6980HS (with lower TDP).
The chip integrates a modern RDNA 3-based graphics card (iGPU) called Radeon 780M with 12 CUs and up to 2.7GHz including AV1 video engine. Furthermore, a Xilinx FPGA-based XDNA AI accelerator is also integrated, which is now clocked higher. Hawk Point offers 2x USB 4 (40 Gbps), 20 PCIe 4.0 lanes and a dual-channel DDR5-5600 / LPDDR5x-7500 memory controller (with ECC support).
The Hawk Point series is a single chip (unlike the Dragon Range 7045HX series) and is manufactured at TSMC using the modern 4nm FinFET process.
AMD Ryzen 9 PRO 8945HS
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The Ryzen 9 PRO 8945HS is a powerful Hawk Point family processor (APU) released in April 2024. The R9 PRO 8945HS is identical to the "normal" R9 8945HS in virtually all respects; both come with 8 Zen 4 cores running at 4.0 GHz to 5.2 GHz (16 processing threads), a 16-TOPS Ryzen AI NPU (higher clock speeds) and the top-of-the-line Radeon 780M graphics adapter. Other key features include PCIe 4 and USB 4 support, LPDDR5x-7500 RAM support and 16 MB of L3 cache. Unlike the R9 8945HS however this PRO series chip has ECC memory support and the Secure Processor feature which in a nutshell is an ARM co-processor built into the main chip.
Architecture and Features
Hawk Point APUs are powered by the Zen 4 architecture, just like Dragon Range, Phoenix and Raphael processors are. With this product family, AMD is betting big on generative AI; these chips are said to deliver an up to 40% increase in generative AI performance over 7040 series APUs making apps like DaVinci Resolve and Adobe Photoshop more powerful than ever before.
Unlike Zen 3, Zen 4 features AVX512 support and, thanks to a plethora of other improvements including larger registers/buffers/caches (reportedly at the cost of some of them becoming slightly slower), is supposed to bring an IPC improvement of around 13%.
Elsewhere, the R9 PRO 8945HS has 16 MB of L3 cache and support for super-fast RAM (up to LPDDR5x-7500 or DDR5-5600 with ECC support optionally present depending on the socket). The processor is compatible with USB 4 and thus with Thunderbolt; PCIe support is limited to the 4.0 spec for a throughput of 1.97 GB/s per lane. 20 lanes are available.
OS support is limited to 64-bit editions of Windows 11 and Windows 10 and of course to Linux. Note that the chip isn't overclockable and neither is it user-replaceable as it gets soldered down for good (FP7, FP7r2, FP8 socket interfaces).
Performance
The 8945HS is an R9 7940HS in disguise, so it's realistic to expect the chip to be just slightly faster than the Core i9-12900HK and also the Ryzen 7 7840HS, as far as multi-thread performance is concerned.
Your mileage may vary depending on how high the CPU power limits are and how competent the cooling solution of your system is.
Graphics
The Radeon 780M has 12 CUs (768 shaders) running at up to 2,800 MHz. This is a very fast iGPU, as of late 2023. It will let you use up to 4 monitors with resolutions as high as SUHD 4320p, and it is also capable of HW-encoding and HW-decoding the most widely used video codecs including AVC, HEVC and AV1. More importantly, it is fast enough for proper 1080p gaming as long as one is fine with low to medium detail settings.
Your mileage may vary depending on how high the CPU power limits are, how competent the cooling solution of the system is, how fast the RAM of the system is (there is no dedicated VRAM here).
Power consumption
This Ryzen 9 series chip has a long-term power limit (default TDP) of 35 W to 54 W, giving laptop makers a choice between longer battery life and higher performance. Either way, an active cooling solution is a must for a system powered by this chip.
The 8945HS is built with TSMC's 4 nm process for high, as of late 2023, energy efficiency.
Model | Intel Core i7-13705H | AMD Ryzen 7 H 260 | AMD Ryzen 9 PRO 8945HS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Codename | Raptor Lake-H | Hawk Point-HS (Zen 4) | Hawk Point-HS (Zen 4) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series | Intel Raptor Lake-H | AMD Hawk Point (Zen 4/4c) | AMD Hawk Point (Zen 4/4c) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Series: Hawk Point (Zen 4/4c) Hawk Point-HS (Zen 4) |
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Clock | 1800 - 5000 MHz | 3800 - 5100 MHz | 4000 - 5200 MHz | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L1 Cache | 1.2 MB | 512 KB | 512 KB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L2 Cache | 11.5 MB | 8 MB | 8 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
L3 Cache | 24 MB | 16 MB | 16 MB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Cores / Threads | 14 / 20 8 x 5.0 GHz Intel Golden Cove P-Core 8 x 3.7 GHz Intel Gracemont E-Core | 8 / 16 8 x 5.1 GHz AMD Zen 4 | 8 / 16 8 x 5.2 GHz AMD Zen 4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
TDP | 45 Watt | 45 Watt | 45 Watt | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Technology | 10 nm | 4 nm | 4 nm | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
max. Temp. | 100 °C | 100 °C | 100 °C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Socket | FCBGA1792 | FP7/FP7r2/FP8 | FP7/FP7r2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Features | Thread Director | DDR5-5600/LPDDR5x-7500 RAM, PCIe 4, Ryzen AI, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | DDR5-5600/LPDDR5x-7500 RAM, PCIe 4, Ryzen AI, MMX, SSE, SSE2, SSE3, SSSE3, SSE4A, SSE4.1, SSE4.2, AVX, AVX2, AVX-512, BMI2, ABM, FMA, ADX, SMEP, SMAP, SMT, CPB, AES-NI, RDRAND, RDSEED, SHA, SME | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
iGPU | Intel Iris Xe Graphics G7 96EUs ( - 1500 MHz) | AMD Radeon 780M ( - 2700 MHz) | AMD Radeon 780M ( - 2800 MHz) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Architecture | x86 | x86 | x86 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Announced | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Manufacturer | ark.intel.com | www.amd.com | www.amd.com | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Die Size | 178 mm2 | 178 mm2 |
Benchmarks
Average Benchmarks Intel Core i7-13705H → 0% n=0

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation