Xbox Series X2 rumored to be significantly faster than the Sony PS6
Leaker Moore's Law is Dead appears to have uncovered the most important details about the technology behind AMD Magnus, the chip intended for the successor to the Xbox Series X. If the leaker's information proves correct, the chip will consist of two chiplets that together have a surface area of 408 mm².
This would make the chip around 13% larger than the Xbox Series X APU, but as much as 46% larger than the AMD Orion chip in the Sony PlayStation 6. While AMD Magnus is said to be the largest chip ever installed in a home console, the APU is still smaller than AMD Ryzen Strix Halo, for example, as the Ryzen AI Max+ 395 covers an area of 441 mm².
With a total of eleven Zen 6 processor cores, an RDNA 5 graphics chip with 68 compute units, and a power dissipation of 250 to 350 watts, the next-generation Xbox is expected to be significantly more powerful than the Sony PlayStation 6. Sony reportedly only uses nine CPU cores and 52 compute units, which should also be capable of lower clock speeds thanks to a power dissipation limit of 150 watts. However, AMD Magnus is also expected to be significantly more expensive than AMD Orion, making it highly likely that the next Xbox will cost more than the PlayStation 6.
Microsoft is also said to be installing an AI accelerator that can run at either 1.2 watts or 6 watts, which should achieve an AI performance of 46 TOPS or 110 TOPS, respectively. The console is expected to launch in 2027, unless it is discontinued sooner, as some rumors have suggested. Here are the key specifications of Xbox Magnus compared to the APUs of the Xbox Series X and the Sony PlayStation 6:
| Xbox Series X | Xbox Series X2 (AMD Magnus) | Sony PS6 (AMD Orion) | |
|---|---|---|---|
| CPU | 8x Zen 2 3,8 GHz | 3x Zen 6 + 8x Zen 6c | 7x Zen 6c + 2x Zen 6 Low Power |
| GPU | 52 CUs RDNA 2 1,825 GHz 12,15 TFLOPS | 68 CUs RDNA 5 | 52 CUs RDNA 5 |
| RAM | 16 GB GDDR6 320-bit bis zu 560 GB/s | bis zu 48 GB 192-bit | 160-bit |
| TDP | ca. 150W | 250W – 350W | 160W |
| Chip surface area | 360,5 mm² | 408 mm² | 280 mm² |
| NPU | N/A | 110 TOPS | N/A |
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