Qualcomm Snapdragon 888 4G vs MediaTek Dimensity 7300 vs MediaTek Dimensity 930
Qualcomm Snapdragon 888 4G
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The Qualcomm Snapdragon 888 4G Mobile Platform is a high-end SoC for smartphones that was introduced in mid 2021 and manufactured in 5 nm at Samsung. Compared to the earlier released Snapdragon 888 5G, the 4G variant only features a 4G LTE modem.
The chip integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz.
The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).
MediaTek Dimensity 7300
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The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
MediaTek Dimensity 930
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The Mediatek Dimensity 930 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit and video de- and encoding.
The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.
Compared to the Dimensity 920, the 930 has a slower clocked CPU, but a faster GPU.
The Dimensity 930 is manufactured in the modern 6nm process and should be very power efficient.
Model | Qualcomm Snapdragon 888 4G | MediaTek Dimensity 7300 | MediaTek Dimensity 930 | ||||||||||||||||
Codename | Cortex-X1 / A78 / A55 (Kryo 680) | Cortex-A78 / A55 | Cortex-A78 / A55 | ||||||||||||||||
Series | Qualcomm Snapdragon | ||||||||||||||||||
Series: Snapdragon Cortex-X1 / A78 / A55 (Kryo 680) |
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Clock | 1800 - 2840 MHz | 2000 - 2500 MHz | 2000 - 2200 MHz | ||||||||||||||||
L3 Cache | 3 MB | ||||||||||||||||||
Cores / Threads | 8 / 8 1 x 2.8 GHz ARM Cortex-X1 3 x 2.4 GHz ARM Cortex-A78 4 x 1.8 GHz ARM Cortex-A55 | 8 / 8 4 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 | ||||||||||||||||
TDP | 5 Watt | ||||||||||||||||||
Technology | 5 nm | 4 nm | 6 nm | ||||||||||||||||
Features | Adreno 660 GPU, Spectra 580 ISP, Hexagon 780, X60 5G Modem, FastConnect 6900 WiFi,LPDDR5-6400 / LPDDR4X-4266 MHz Memory Controller (64 Bit) | 2x ARM Cortex-A78 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), PowerVR BXM-8-256, 5G 2CC-CA FDD+TDD, Dual 5G SIM, Dual VoNR, UFS 3.1, LPDDR5 | |||||||||||||||||
iGPU | Qualcomm Adreno 660 | ARM Mali-G615 MP2 | IMG BXM-8-256 ( - 900 MHz) | ||||||||||||||||
Architecture | ARM | ARM | ARM | ||||||||||||||||
Announced | |||||||||||||||||||
Manufacturer | www.qualcomm.com | www.mediatek.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 888 4G → 100% n=10
Average Benchmarks MediaTek Dimensity 7300 → 100% n=10
Average Benchmarks MediaTek Dimensity 930 → 74% n=10

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation