Qualcomm Snapdragon 845 vs UNISOC T765

Qualcomm Snapdragon 845

The Qualcomm Snapdragon 845 Mobile Platform (or SD845) is a high-end SoC for smartphones that was introduced in early 2018 and manufactured in 10 nm LPP FinFET at TSMC. Integrates 4x Kryo 385 cores (Cortex-A75) at up to 2.8 GHz (max) for performance and 4x Kryo 385 at 1.8 GHz (max) for efficiency. Furthermore offers an X20 LTE modem (Cat. 18 1.2 Gbps downlink, Cat 13 150 Mbps uplink), ac-WiFi and a dual-channel 32-Bit 1866 MHz LPDDR4x memory controller.

UNISOC T765

The UniSoc T765 is a mid-range SoC with 8 processor cores in two clusters. The two large ARM Cortex-A76 cores are clocked at up to 2.3 GHz. The six smaller cores run at up to 2.1 GHz.

The integrated memory controller supports LPDDR4/4X with up to 2133 MHz (2x 16 bit). The integrated ISP supports a camera up to 108 MPixel. The integrated graphics card is an ARM Mali-G57 MC2 (2 cores) is used. The built-in 5G modem supports TDD+FDD CA in the sub-6GHz spectrum with 130 MHz bandwidth.

The chip is manufactured using the somewhat older 6nm process (EUV at TSMC).