Qualcomm Snapdragon 765 vs MediaTek Dimensity 720
Qualcomm Snapdragon 765
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The Qualcomm Snapdragon 765 (SD765 Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core, called Kryo 475) divided into two clusters. A fast performance cluster contains two ARM Cortex-A76 cores clocked at up to 2.3 GHz (prime core) and 2.2 GHz (gold core) and a power efficiency cluster with six small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds.
Compared to the gaming optimized Snapdragon 765G, the 765 offers -100 MHz less clock speed on the prime core and a lower clocked GPU.
The processor performance is quite comparable to the old Snapdragon 730G. Only the single core performance can be slightly better, thanks to the higher clocked prime core.
The chip is one of the first SoCs that integrate a 5G modem. It is called Snapdragon X52 and supports speeds of up to 3.7 / 1.6 Mbps (down- and upload) and mmWave and Sub-6.
The integrated Adreno 620 offers a 16.7% lower performance than the same GPU in the SD 768G and also misses some of the softare gaming features.
The integrated AI engine uses the GPU, CPU and dedicated cores to reach a theoretical maximum performance of approx. 5.5 TOPS (value from the slightly faster SD 768G).
The processor is manufactured in the modern and energy efficient 7nm EUV process at Samsung.
MediaTek Dimensity 720
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The Mediatek Dimensity 720 is a mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A76 cores and four power efficient Cortex-A55 cores, all clocked at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 3 core ARM Mali-G57 MC3 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU) and video de- and encoding. Compared to the faster Dimensity 820, the CPU cores are lower clocked and the GPU offers less cores. Furthermore, all other features were slightly restricted (e.g. max. 12 GB RAM).
The Dimensity 720 is manufactured in the modern 7nm process and should be very power efficient.
Model | Qualcomm Snapdragon 765 | MediaTek Dimensity 720 | ||||||||
Codename | Kryo 475 Gold / Silver | Cortex-A76 / A55 | ||||||||
Series | Qualcomm Snapdragon | |||||||||
Series: Snapdragon Kryo 475 Gold / Silver |
| |||||||||
Clock | 1800 - 2300 MHz | 2000 MHz | ||||||||
Cores / Threads | 8 / 8 | 8 / 8 | ||||||||
Technology | 7 nm | 7 nm | ||||||||
Features | Adreno 620 GPU, X52 5G/LTE Modem, Hexagon 696 DSP, Specra 355 ISP | 4x ARM Cortex-A76 (2 GHz), 4x ARM Cortex-A55 (2 GHz), ARM Mali-G57 MC3, APU 3.0, 5G Modem, MiraVision (4K30 Video, 64MP Photo), Wi-Fi 5, Bluetooth 5.1, UFS 2.2, 12GB LPDDR4x Support | ||||||||
iGPU | Qualcomm Adreno 620 | ARM Mali-G57 MP3 | ||||||||
Architecture | ARM | ARM | ||||||||
Announced | ||||||||||
Manufacturer | www.qualcomm.com | www.mediatek.com |
Benchmarks
Average Benchmarks Qualcomm Snapdragon 765 → 100% n=20
Average Benchmarks MediaTek Dimensity 720 → 131% n=20

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation