Redmi K40 and Redmi K40 Pro teardown video reveals Xiaomi's LiquidCool Technology heat dissipation solution and modular camera hardware

Xiaomi is yet to give the Redmi K40 series a global launch like it has with the Mi 11, but a teardown video has offered an insight into what hardware the company has included in its new Redmi smartphones. The video focuses on the Redmi K40 and the Redmi K40 Pro, although the Redmi K40 Pro Plus only differs from the former in RAM and in its main camera sensor.

More differences exist between the Redmi K40 and the Redmi K40 Pro, including Xiaomi's use of the Snapdragon 870 in one and the Snapdragon 888 in the other. The insides of both devices look almost identical, so it seems that Xiaomi has done nothing extra in the Redmi K40 Pro to cool its notoriously-hot Snapdragon 888 chipset.

However, XYZone's video demonstrates that the Redmi K40 runs slightly hotter than the Redmi K40 Pro does under the same conditions, despite effectively having a Snapdragon 865 Plus. Based on the video, Xiaomi's LiquidCool Technology is nothing more than a small copper heat pipe, heat shielding and some thermal pads, which pales in comparison to the sizeable cooling solution found in the Mi 10 Ultra.

We are impressed by the rear-facing cameras' modularity in the Redmi K40 and Redmi K40 Pro, though. Typically, smartphone manufacturers group these together, but Xiaomi has kept them in dedicated housings. There is also a huge battery pull tab that should make replacing the battery a painless experience.

It is unclear when Xiaomi will release the Redmi K40 and the Redmi K40 Pro globally. It seems that the two will arrive in many markets as POCO F3 smartphones though, as we have reported.

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