Qualcomm and BOE announce a collaboration to bring 3D Sonic fingerprint sensing to more displays

The display specialist BOE and chip manufacturer Qualcomm have released details on a new collaboration to get the latter's 3D Sonic ultrasonic fingerprint sensors into more display types and categories. This project is intended to confer more devices and integrated panels with what is touted as "the industry’s thinnest and highest security fingerprint solution" by its maker.

Therefore, a whole new dimension of electronics may now become 3D fingerprint-reader enabled. Qualcomm and BOE envision that they will include extended-reality (XR) products, devices involved in 5G ecosystems, and IoT components. Furthermore, the display-maker has announced that the sensors will also be present in its flexible OLED panels.

Therefore, in-display sensors may become a more immediate possibility for the foldable mobile devices of the near future. The 2 companies have also hinted that these panels may also come with even more Qualcomm-related advantages as a result of this collaboration. BOE has yet to specify exactly when it will be able to supply OEMs with these feature-rich panels.