Leaked roadmap reveals Intel's 'Cascade Lake-X' HEDT along with new 35W 'Coffee Lake-S' offerings
Time for another roadmap leak; this time from the GALAX GOC Gaming gathering held recently in China. The leaked roadmap reveals Intel's plans for 'Coffee Lake-S' chips in the 65W and 35W TDP range along with a new codename for the upcoming HEDT CPU, 'Cascade Lake-X'. 'Cascade Lake-X' will launch sometime around Q4 2018 and succeed existing 'Skylake-X' chips. Not much is known about 'Cascade Lake-X' apart from the codename but it is being speculated that it will be a refresh of 'Skylake-X' using the 14nm++ process, which could imply that these chips should be compatible with existing X299 chipset motherboards featuring LGA 2066 sockets. 'Skylake-X' has a rated TDP of 165W so we can expect the TDP of 'Cascade Lake-X' to hover around similar values.
The other important takeaway from the leaked roadmap is the arrival of 35W 'Coffee Lake-S' chips starting from Q1 2018 based on the Intel 300-Series chipset. We have already seen laptops from Clevo featuring desktop-class 'Coffee Lake-S' CPUs (6 core and 4 core) using the Intel Z370 chipset in 95W and 65W TDP variants. Going by this roadmap, 35W chips (4 core and 2 core) should soon hit the market. It is interesting that there is no mention of 45W 'Coffee Lake-H' chips as was speculated earlier. Corroborating this news with Frank Azor's revelation a few weeks ago about Dell waiting for 45W H-series chip from Intel, we might still see a 'Coffee Lake-H' series chip that will fill the 45W void. It could be likely that information about the chip was not meant to be revealed during this presentation.
Lastly, we see the 10W 'Gemini Lake' in 4- and 2-core variants on track for a 2018 launch, although, we have earlier reported of a convertible shown off in a Hong Kong trade fair featuring Intel's new low-end CPU.
Top 10 Smartphones
Smartphones, Phablets, ≤5-inch, Camera SmartphonesNotebookcheck's Top 10 Smartphones under 160 Euros