HiSilicon Kirin 810 vs HiSilicon Kirin 980

HiSilicon Kirin 810

The HiSilicon Kirin 810 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2019 and contains 8 processor cores. Two fast ARM Cortex-A76 cores with up to 2.27 GHz and six small power efficient ARM Cortex-A55 cores with up to 1.88 GHz (bigLITTLE). Furthermore, the SoC integrates a mid range graphics card called ARM Mali-G52 MP6 with 6 clusters. For AI acceleration, the Kirin 810 integrates a Ascend D100 Lite NPU (Da Vinci architecture). The integrates LTE modem supports Cat.12/13 with Dual Sim VoLTE. For photography, the Kirin 810 integrates the Kirin ISP4.0. The memory controller supports LPDDR4X at up to 2133 MHz. Furthermore, WiFi 802.11ac and Bluetooth 5.0 are integrated in the chip.

The SoC is manufactured in the modern 7nm process at TSMC and therefore should be very energy efficient.

HiSilicon Kirin 980

The HiSilicon Kirin 980 is an ARM based high-end octa-core SoC for smartphones and tablets, which was introduced with the Huawei Mate 20 Pro in late 2018. It integrates eight CPU cores in three clusters. The performance cluster contains two Cortex-A76 cores with up to 2.6 GHz, the balanced cluster contains also two Cortex-A76 cores but with only up to 1.92 GHz and finally the power saving cluster contains four small ARM Cortex-A53 cores with up to 1.8 GHz. Furthermore, the SoC integrates a modern LTE radio with Cat 21/18 (max. 1400 Mbps download, 200 Mbps upload), 2x faster dual ISP (versus 970), a LPDDR4X 2133 MHz memory controller (34.1 GB/s versus 29.9 GB/s of the Kirin 970) and a 2160p30 H.265 video encoder (2160p60 decoding). The Kirin 980 is produced in the modern 7nm process at TSMC as the first Android SoC (after the Apple A12).