HiSilicon Kirin 710 vs Mediatek Helio G70
HiSilicon Kirin 710
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The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower.
The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).
The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).
Mediatek Helio G70
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The Mediatek Helio G70 is a mainstream ARM SoC for smartphones (mainly Android based) that was introduced in 2020. It is manufactured in a 12 nm FinFET process and integrates 8 CPU cores. Two fast ARM Cortex-A75 cores with up to 2 GHz for performance tasks and six small ARM Cortex-A55 with up to 1.7 GHz for efficiency. All eight cores can be used together thanks to Heterogeneous Multi-Processing support. The integrated GPU is a ARM Mali-G52 MC2 (MP2) with two clusters at up to 820 MHz. The SoC also integrates the HyperEngine that handles a dynamic management of CPU, GPU and memory.
Compared to the slightly faster Helio G80, the difference to the G70 is the slightly lower clock speed for the A55 cores (-100 MHz) and GPU (-130 MHz).
The SoC integrates furthermore a LTE radio with Cat-7 (download) / Cat-13 (upload) support, Wifi 5 (ac), Bluetooth 5.0, LPDDR4x 1800 MHz and eMMC 5.1 storage.
Model | HiSilicon Kirin 710 | Mediatek Helio G70 | ||||||||||||||||||||||||
Codename | Cortex-A73/-A53 | Cortex-A75 / A55 | ||||||||||||||||||||||||
Clock | 2200 MHz | 2000 MHz | ||||||||||||||||||||||||
Cores / Threads | 8 / 8 | 8 / 8 | ||||||||||||||||||||||||
Transistors | 5500 Million | |||||||||||||||||||||||||
Technology | 12 nm | 12 nm | ||||||||||||||||||||||||
Features | ARM Mali-G51 MP4 GPU, 4x Cortex-A73 (2.2 GHz) + 4x Cortex-A53 (1.7 GHz, big.LITTLE), LTE Cat-12 600 Mbps Downlink, Cat-13 150 Mbps Uplink, Bluetooth 4.2, WiFi a/b/g/n 2.4 GHz, AGPS, Glonass, Baidou | 4x ARM Cortex-A73, 4x ARM Cortex-A53, | ||||||||||||||||||||||||
iGPU | ARM Mali-G51 MP4 | ARM Mali-G52 MP2 ( - 820 MHz) | ||||||||||||||||||||||||
Architecture | ARM | ARM | ||||||||||||||||||||||||
Announced | ||||||||||||||||||||||||||
Series | Mediatek Mediatek Helio G | |||||||||||||||||||||||||
Series: Mediatek Helio G Cortex-A75 / A55 |
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Manufacturer | www.mediatek.com |
Benchmarks
Average Benchmarks HiSilicon Kirin 710 → 100% n=26
Average Benchmarks Mediatek Helio G70 → 107% n=26

* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation