HiSilicon Kirin 710 vs Samsung Exynos 7885

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).

Samsung Exynos 7885

The Samsung Exynos 7885 (also called Exynos 7 Series) is a upper mid-range system-on-a-chip (SoC) for smartphones and tablets. It was launched early 2018 alongside the Samsung Galaxy A8 2018 series and features two Cortex-A73 cores clocked at up to 2.2 GHz. Furthermore, there are six power efficient Cortex-A53 cores at up to 1.6 GHz, an ARM Mali-G71 MP2 GPU and a LPDDR4x memory controller. The integrated LTE modem supports LTE Cat.12 3CA 600 Mbps download speeds and Cat.13 2CA 150 Mbps upload. 802.11ac WiFi, Bluetooth 5.0 and FM Radio are also in the chip. It is manufactured in 14nm FinFET at Samsung and therefore a rather power efficient SoC.