Mediatek Helio P60 vs HiSilicon Kirin 710

Mediatek Helio P60

The Mediatek Helio P60 is an upper mainstream ARM SoC for smartphones (mainly Android based) that was introduced in early 2018. It is manufactured in a 12 nm FinFET (12FFC) process and is equipped with 4x big ARM Cortex-A73 cores and 4x small and power efficient ARM Cortex-A53 cores in two clusters (bigLITTLE). The cores can reach a frequency of up to 2 GHz. The processor also integrates a ARM Mali-G72MP3 GPU and a dedicated AI processing unit. Furthermore, the integrated radio supports Cat-7 (DL) / Cat-13 (UL) LTE, 802.11ac, Bluetooth 4.2, and FM radio.

HiSilicon Kirin 710

The HiSilicon Kirin 710 is a ARM-based mid-range Octa-Core-SoC for Android based smartphones and tablets. It was announced mid 2018 and contains 8 processor cores (4x Cortex-A73 at up to 2.2 GHz, 4x Cortex-A53 at up to 1.7 GHz, BigLITTLE), an ARM Mali G51 MP4, a dual-channel LPDDR4 memory controller and a LTE radio (600 Mbps down, 150 Mbps up). Therefore, the CPU part is similar to the Kirin 960 and 970 (both higher clocked), but the graphics card is a lot slower. 

The Kirin 710 is manufactured at TSMC in 12 nm (compared to the 16nm Kirin 960 and 10nm Kirin 970).

The HiSilicon Kirin 710F is the same chip with a different package (FCCSP - Flip Chip Chip Scale Package) and offers the same specifications (see e.g. our review of the Huawei P Smart Z).