MediaTek Dimensity 7300 vs Qualcomm Snapdragon 865+ (Plus) vs MediaTek Dimensity 1100

MediaTek Dimensity 7300

The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.

In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.

The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.

Qualcomm Snapdragon 865+ (Plus)

The Qualcomm Snapdragon 865+ (Plus) Mobile Platform is a high-end smartphone and tablet SoC that Qualcomm announced in mid 2020. The SoC integrates a fast ‘Prime Core’ that clocks up to 3.1 GHz and three additional ARM Cortex-A77 performance cores, which can reach up to 2.42 GHz. These are complemented by four power-saving ARM Cortex-A55 cores that clock up to a maximum of 1.8 GHz. The difference to the older Snapdragon 865 is the faster clocked Prime Core and 10% higher clocked GPU.

Therefore, the Snapdragon 865 takes the top spot in mobile processors for Android based systems. In some multi-core workloads, the SD865+ can even perform on par with the Apple A13 SoC. Single thread, however is still a strong suit of the Apple SoCs.

Compared to the previous generations, the Snapdragon 865 and 865 Plus does not integrate an LTE modem anymore, but has to be paired with the new X55 5G modem, that also supports LTE Cat 24/22. The Wi-Fi module however is still integrated and called FastConnect 6800 with support for Wi-Fi 6 (802.11ax) and 8x8 MU-MIMU and 60 GHz 802.11ay with up to 10 Gbps. Bluetooth 5.1 is also supported including aptX Adaptive.

The integrated GPU is still called Adreno 650 and should offer 10% more performance than the Adreno 650 in the Snapdragon 865 (thanks to higher clock speed).

The on board Hexagon 698 DSP now offers a KI performance of up to 15 TOPS (up from 7 TOPS in the 855) and still uses a combination of CPU, GPU, HVX and Tensor cores. The Spectra 480 ISP is also untouched. The integrated Computer Vision Engine (CV-ISP) now supports Dolby Vision, 8K videos and 200 megapixel photos.

The built-in memory controller supports LPDDR5 with up to 2,750 MHz and LPDDR4X with 2,133 MHz.

The Snapdragon 855+ is manufactured at TSMC in the new improved 7nm process (N7P, DUV-based). The process offers a 7% higher performance or 10% less power consumption compared to the old N7 process.

MediaTek Dimensity 1100

The Mediatek Dimensity 1100 is a fast mid-range SoC with an integrated 5G modem. It includes four fast ARM Cortex-A78 cores at up to 2.6 GHz and four power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 5 modem, a LPDDR4x memory controller, a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding. As one of the first SoCs, the Dimensity 1000 series offers AV1 hardware decoding. The chip is manufactured in the modern 7nm process and should be very power efficient.