MediaTek Dimensity 7300 vs Qualcomm Snapdragon 7s Gen 2 vs MediaTek Dimensity 930
MediaTek Dimensity 7300
► remove from comparison
The MediaTek Dimensity 7300 is an ARM-based mid-range SoC for (mostly Android based) smartphones. The integrated CPU is divided into two clusters with four larger ARM Cortex-A78 cores with up to 2.5 GHz clock speed and an efficiency cluster with four ARM Cortex-A55 cores with up to 2 GHz.
In addition to the integrated ARM Mali-G615 MC2 iGPU, the 7300 also offers a MediaTek APU 655 for AI tasks. Furthermore, a 5G multi-mode modem is installed (2G - 5G) with up to 3.27 Gbps download speed. In addition to Wi-Fi 6E, Bluetooth 5.4 is also supported.
The chip is manufactured using the modern 4nm process and is advertised to consume 25% less power compared to the older Dimensity 7050.
Qualcomm Snapdragon 7s Gen 2
► remove from comparison
The Qualcomm Snapdragon 7s Gen 2 (SM7435-AB) is an ARMv9-A-based SoC for tablets and smartphones in the upper mid-range segment.
The Qualcomm Snapdragon 7s Gen 2 integrates a total of 8 cores divided into two clusters. The ARM Cortex-A78 cluster for high performance offers four cores with up to 2.4 GHz. The remaining 4 cores are based on the more energy-efficient A55 architecture and can be clocked at up to 1.95 GHz. All cores can run simultaneously or just a single cluster.
The SoC is similar to the Snapdragon 7 Gen 1 which offers a slightly lower clocked efficiency cluster and a different named GPU. The similar named Snapdragon 7+ Gen 2 is clearly faster with newer CPU cores. Although the naming suggest it, there was no Snapdragon 7s Gen 1.
LPDDR5 RAM is supported, with a frequency of up to 6,400 MHz.
The Snapdragon X62 5G modem is used as the modem. It supports a range of SA and NSA 5G mmWave and sub-6 GHz frequencies as well as Dynamic Spectrum Sharing (DSS). The X62 can achieve a maximum downlink speed of up to 2.9 Gbit/s in 5G networks.
The Adreno 710 forms the graphics subsystem. The GPU is capable of driving FHD+ displays at up to 144 Hz.
The Qualcomm Snapdragon 7s Gen 2 is manufactured using the modern 4nm EUV process.
MediaTek Dimensity 930
► remove from comparison
The Mediatek Dimensity 930 is a fast mid-range SoC with an integrated 5G modem. It includes two fast ARM Cortex-A78 cores at up to 2.2 GHz and six power efficient Cortex-A55 cores at up to 2 GHz (Octa-Core with Heterogeneous Multi-Processing). Furthermore, the chip integrates a IMG BXM-8-256 GPU, a Wi-Fi 5 modem, a LPDDR5 / LPDDR4X memory controller, a AI processing unit and video de- and encoding.
The 5G modem supports NR 2CC and mixed duplex (TDD/FDD) and dual SIM. The download speeds can reach up to 2.77 Gbit/s.
Compared to the Dimensity 920, the 930 has a slower clocked CPU, but a faster GPU.
The Dimensity 930 is manufactured in the modern 6nm process and should be very power efficient.
| Model | MediaTek Dimensity 7300 | Qualcomm Snapdragon 7s Gen 2 | MediaTek Dimensity 930 |
| Codename | Cortex-A78 / A55 | Cortex-A78 / A55 | Cortex-A78 / A55 |
| Clock | 2000 - 2500 MHz | 1950 - 2400 MHz | 2000 - 2200 MHz |
| Cores / Threads | 8 / 8 4 x 2.6 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 4 x 2.4 GHz ARM Cortex-A78 4 x 2.0 GHz ARM Cortex-A55 | 8 / 8 |
| Technology | 4 nm | 4 nm | 6 nm |
| iGPU | ARM Mali-G615 MP2 | Qualcomm Adreno 710 | IMG BXM-8-256 ( - 900 MHz) |
| Architecture | ARM | ARM | ARM |
| Announced | |||
| Manufacturer | www.mediatek.com | www.qualcomm.com | www.mediatek.com |
| Series | Qualcomm Snapdragon | ||
| Features | 2x ARM Cortex-A78 (2.2 GHz), 6x ARM Cortex-A55 (2 GHz), PowerVR BXM-8-256, 5G 2CC-CA FDD+TDD, Dual 5G SIM, Dual VoNR, UFS 3.1, LPDDR5 |
Benchmarks
Average Benchmarks MediaTek Dimensity 7300 → 100% n=12
Average Benchmarks Qualcomm Snapdragon 7s Gen 2 → 97% n=12
Average Benchmarks MediaTek Dimensity 930 → 75% n=12
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
