MediaTek Dimensity 1200 vs Qualcomm Snapdragon 888 5G

MediaTek Dimensity 1200

The Mediatek Dimensity 1200 (MT6893) is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz.

Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).

The chip is manufactured in the modern 6nm process and should be very power efficient.

Qualcomm Snapdragon 888 5G

The Qualcomm Snapdragon 888 5G Mobile Platform is a high-end SoC for smartphones that was introduced in late 2020 and manufactured in 5 nm at Samsung. Integrates one “Prime Core” based on a ARM Cortex-X1 architecture clocked at up to 2.84 GHz. Three more performance cores are based on the A78 but clock up to 2.42 GHz. Furthermore, four energy saving cores are integrated that are based on the ARM Cortex-A55 architecture and clock at up to 1.8 GHz. In addition to the processor cores, the SoC integrates a WiFi 6e modem, a Hexagon 780 DSP (up to 26 TOPS of AI performance) and a Spectra 580 ISP. The integrated memory controller now supports faster LPDDR5 memory with up to 3,200 MHz. 5G is now included in the chip with the Snapdragon X60 modem.

The performance of the processor cores should be around 15% better than the old Snapdragon 865+. The integrated Adreon 660 GPU should make a bigger jump by 35% (most likely compared to the SD 865).