MediaTek Dimensity 1200 vs Qualcomm Snapdragon 778G 5G vs MediaTek Dimensity 8100

MediaTek Dimensity 1200

The Mediatek Dimensity 1200 (MT6893) is a high-end SoC with an integrated 5G modem. It includes three CPU clusters. One fast ARM Cortex-A78 at up to 3 GHz with 2x L2 cache, 3 additional A78 with up to 2.6 GHz and for power efficiency four ARM Cortex-A55 cores at up to 2 GHz.

Furthermore, the chip integrates a 9 core ARM Mali-G77 MC9 GPU, a Wi-fi 6 modem (ax), a LPDDR4x memory controller (up to 5266Mbps), a AI processing unit (APU 3.0 with 6 cores) and video de- and encoding (including AV1).

The chip is manufactured in the modern 6nm process and should be very power efficient.

Qualcomm Snapdragon 778G 5G

The Qualcomm Snapdragon 778G 5G (SDM778G 5G Mobile Platform) is a fast mid-range ARM-based SoC largely found on Android tablets and smartphones. It integrates eight cores (octa-core) divided into two clusters. A fast performance cluster with four cores based on the ARM Cortex-A78 architecture with up to 2.4 GHz and a power efficiency cluster with four small ARM Cortex-A55 cores at up to 1.8 GHz. Depending on the workload only single clusters or all cores can run at different clock speeds.

Thanks to the new Cortex-A78 cores, the CPU performance increases by up to 40% compared to the old Snapdragon 768G according to Qualcomm. In our benchmarks, the 778G is able to reach the performance of the old high end chip Kirin 990. 

The integrated X53 5G modem supports up to 3.3 Gbps with sub 6Ghz. The FastConnect 6900 Wi-Fi modem supports the current Wi-Fi 6e standard with 6GHz.

The integrated Qualcomm Adreno 642L offers a 40% higher performance compared to the old Adreno 620 in the predecessor. This is partly thanks to the fast memory controller with LPDDR5-3200 support.

The integrated 6th gen AI engine called Hexagon 770 offers a 2x improvement and up to 12 TOPS of performance. The Spectra 570 ISP (image signal processor) supports up to three cameras. The satellite system supports all major standards like Beidou, Galileo, GLONASS and GPS.

The G specifies an optimized SoC for gaming and e.g. Qualcomm offers updates for the graphics driver.

The Snapdragon 778G is manufactured in the modern 6 nm process at TSMC (vs the 5LPE of the 780G).

MediaTek Dimensity 8100

The Mediatek Dimensity 8100 is a upper mid-range smartphone SoC. The CPU integrates four fast ARM Cortex-A78 cores with up to 2.85 GHz and four efficient Cortex-A55 cores with up to 2 GHz. The integrated 5G modem supports all modern standards including 5G SA and a maximum download speed of 4.7 Gbps.

The integrated ARM Mali-G610 MC6 GPU integrates 6 cores and supports displays with up to 2,960 x 1,440 pixels (WQHD+).

The chip is produced at TSMC in 5nm.