Samsung unveils its new mobile cooling solution as part of the Galaxy S22-series launch event

Samsung's latest Galaxy Unpacked event is underway at this moment, and has already confirmed some of the most tantalizing leaks concerning the new premium line. This includes their upgrade to a new 4nm platform. Then again, the South Korean giant focused more on how it intends to keep this silicon cool during its ongoing major product launch.

Samsung did mention that the S22 series is rated for up to 73% more machine-learning power due to its new platform (or platforms, rather). Accordingly, that potentially significant increase might need significant cooling. The OEM asserts that it goes far beyond the average heat-pipe.

This starts with the phones' new varieties of thermal interface material (TIM), which comes in 2 forms: Gel and Flexible Nano-TIM. Based on its location and apparent functions, the former seems to play the role of thermal paste, and delivers "3.5x more efficient heat transfer". The second is rated to supersede older forms of solid or metallic TIM through a greater ability to bend in response to heat in order to re-allocate it to the S22's new vapor chamber (VC).

VCs are typically found over the PCB in question; however, Samsung claims that its new choice of location, over a given S22 device's battery, will result in superior cooling. The system also incorporates a "durable double-bonded stainless steel structure", not to mention the predictable graphite sheeting.

Finally, Samsung notes that thermal management on will be augmented by its software as well. Then again, it's worth pointing out that the OEM never mentions the actual identity of the SoC underneath all these new layers of cooling, making it impossible to determine whether each component will be found across the S22 series' Snapdragon 8 Gen 1- and Exynos 2200-powered units.

Stay tuned for our upcoming Galaxy S22-series reviews for more details that might help clear this ambiguity up, not to mention how well Samsung's cooling hype holds up in testing.