Intel Xeon W-11855M vs Apple M3 vs Apple M3 Pro 12-Core

Intel Xeon W-11855M

The Intel Xeon W-11855M is a high end hexa core SoC for laptops and mobile workstations. It is based on the Tiger Lake H45 generation and was announced in mid 2021. It integrates six Willow Cove processor cores (12 threads thanks to HyperThreading). The base clock speed depends on the TDP setting and at 45 Watt is at 3.2 GHz. The single and dual core boost speed can reach up to 4.9 GHz (using ITBM 3.0), all cores can reach up to 4.4 GHz. The CPU offers 18 MB level 3 cache and supports DDR4-3200 memory.

The Xeon W-11855M is the fastest 6-core CPU of the Tiger Lake line-up at launch and should easily best the older 6 core CPUs thanks to the high clock speeds and the new architecture. Therefore, the Xeon is well suited for even very demanding tasks and is only bested by the 8-core CPUs like the W-11955M.

The SoC also included the improved Xe graphics card called UHD graphics with all 32 EUs.

Furthermore, Tiger Lake SoCs add PCIe 4 support (20 lanes in the H45 series), AI hardware acceleration, and the partial integration of Thunderbolt 4/USB 4 and Wi-Fi 6E in the chip.

The chip is produced on the improved 10nm process (called 10nm SuperFin) at Intel, which should be comparable to the 7nm process at TSMC (e.g. Ryzen 4000 series). The default TDP is rated at 45 W at 3.2 GHz base speed, at 35 Watt the base clock speed decreases to 2.6 GHz (cTDP down).

All articles on Tiger Lake can be found on our Tiger Lake architecture hub.

Apple M3

The Apple M3 is a system on a chip (SoC) from Apple for notebooks that was introduced in late 2023. It integrates a new 8-core CPU with 4 performance cores with up to 4.06 GHz and 4 efficiency cores running at up to 2.75 GHz. Apple claims that the CPU is up to 20% faster than in the old Apple M2 (3.5 GHz). 

Due to the higher clock speeds and architecture improvements, the processor performance is also significantly better than the M2 in benchmarks (see e.g. Geekbench below) and can keep up with the fastest CPUs in short single-core tests (like the Raptor Lake i9-13950HX).

The M3 also integrates a new graphics adapter with dynamic caching, mesh shading and ray tracing acceleration called Apple M3 10-Core GPU. According to Apple, it is 20% faster than the GPU in the M2. The chip integrates again 10 GPU cores, but the cheaper variant only offers 8 cores (e.g. in the entry iMac). Later in early 2025 Apple also introduced a 9-core variant in the new iPad Air models. Furthermore, the GPU only supports 2 displays (an additional 6K60 display to the internal one).

Both GPU and CPU can access the unified memory on the package together. It is still available in 8, 16 and 24 GB variants and offers the same 100 GB/s maximum bandwidth (unlike the Pro models that feature a reduced memory bandwidth). 

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (versus 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.

Unfortunately, the integrated wireless network module only supports Wi-Fi 6E (no Wi-Fi 7) and due to the support of only a single external monitor, the chip also has to make do with no Thunderbolt 4 (Thunderbolt 3 / USB 4 support only for up to 40 Gbit/s).

The chip is manufactured on the current 3nm TSMC process (N3B most likely) and contains 25 billion transistors (+25% vs. Apple M2). The 3nm process should also contribute to the excellent efficiency of the chip. Under load, the M3 CPU consumes approximately 20 Watt.

Apple M3 Pro 12-Core

The Apple M3 Pro (12 Core) is a system on a chip (SoC) from Apple for notebooks that was launched in late 2023. It integrates a new 12-core CPU with 6 performance cores with up to 4.06 GHz and 6 efficiency cores with 2.8 GHz. There is also a slimmed-down 11-core variant with a 14-core GPU.

Compared to the M2 Pro the M3 Pro has been slimmed down somewhat and swaps two performance cores for efficiency cores. This is due to the changed core configuration, as 6 cores are now used per cluster (the M2 Pro and M3 still have 4 cores per cluster). Furthermore, the memory bus has been reduced from 256 bits to 192 bits (150 GB/s vs. 200 GB/s). However, thanks to the new architecture and higher clock rates, the new M3 Pro is still slightly faster.

The M3 Pro also integrates a new graphics card with dynamic caching, mesh shading and ray tracing acceleration via hardware. In the top model, all 18 cores of the chip are used and support up to 3 displays simultaneously (internal and 2 external).

GPU and CPU can jointly access the shared memory on the package (unified memory). This is available in 18 or 36 GB variants and offers 150 GB/s maximum bandwidth (192 bit bus).

The integrated 16-core Neural Engine has also been revised and now offers 18 TOPS peak performance (compared to 15.8 TOPS in the M2 but 35 TOPS in the new A17 Pro). The video engine now also supports AV1 decoding in hardware. H.264, HEVC and ProRes (RAW) can still be decoded and encoded.

Unfortunately, the integrated WLAN only continues to support WiFi 6E (no WiFi 7), unlike the small M3 SoC thunderbolt 4 is also supported (max 40 Gbit/s).

The chip is manufactured in the current 3nm process (N3B) at TSMC and contains 37 billion transistors (-7.5% vs. Apple M2 Pro).