Renders of the Google Pixel 10, Pixel 10 Pro, and Pixel 10 Pro XL have now leaked, revealing the designs of Google's upcoming flagship phones. The Pixel 10 series is expected to get several upgrades, including Google's next-gen Tensor G5, but it now appears that chipset may not be much of an upgrade in reality.
As widely reported, Google has contracted TSMC to manufacture the Tensor G5 on its 3nm node, after four generations of Samsung-built Tensor chipsets. While that would normally raise hopes of significantly improved performance for the Tensor G5, the next-gen chipset has now been tipped to be identical to last year's SoC. According to leaker Chunvn8888, Pixel series lovers can expect the Tensor G5 to perform on the same level as the Tensor G4, with the only difference being a switch to TSMC's process.
That isn't a baseless claim either—alleged benchmarks of the Tensor G5 surfaced last year with scores on par with the Tensor G4. Those tests were likely run on an early prototype, but it seems unlikely that the final product would be significantly more powerful. Even outside of benchmarks, the Tensor G5 is rumored to only offer support for UFS 3.1 storage, which would be disappointing seeing as even 2023's Snapdragon 8 Gen 3 already delivered UFS 4.0 support.
Regardless, fans of the series are unlikely to care much about the Tensor G5 being the latest in the series to fall far behind the competition, with Google marketing the lineup for its real-world performance. The switch to TSMC's 3nm node should vastly improve efficiency and sustained performance too, which buyers of the Pixel 10 series may well value more.