Qualcomm Snapdragon 460 vs Mediatek Helio G25 vs Mediatek Helio G37
Qualcomm Snapdragon 460
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The Qualcomm Snapdragon 460 (SM4250) is a lower mainstream SoC for (Android based) smartphones and tablets. It features eight cores in two clusters. A performance cluster with four ARM Cortex A73 cores and a efficiency cluster with four small ARM Cortex A53 cores. All cores can reach up to 1.8 GHz.
The integrated Qualcomm X11 LTE modem can reach Cat. 13 (400 Mbps max) download and Cat. 12 (150 Mbps max.) upload speeds. The SoC also integrates WiFi 6, however only MIMO 1x1 and therefore the top speed is not very good.
The SD460 is manufactured in the modern 11nm process and should be very energy efficient.
Mediatek Helio G25
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The Mediatek Helio G25 is an entry level ARM SoC for smartphones (mainly Android based) that was introduced in late 2020. It is manufactured in a 12 nm FinFET process and is equipped with 8 ARM Cortex-A53 CPU cores divided in two clusters. A performance cluster with 4 cores clocked at up to 2 GHz and a efficiency cluster clocked at up to 1.5 GHz. Compared to the similar Helio A25, the G25 clocks the GPU (+50 MHz) and the CPU cores higher (+200 MHz).
Furthermore, the SoC integrates a LTE Cat.4 modem, a LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 memory controller, a IMG PowerVR GE8320 graphics card and a 1080p30 video de- and encoder (H.265 decoding, H.264 encoding).
Mediatek Helio G37
► remove from comparisonThe Mediatek Helio G37 is an entry level ARM SoC for smartphones (mainly Android based) that was introduced in late 2020. It is manufactured in a 12 nm FinFET process and is equipped with 8 ARM Cortex-A53 CPU cores clocked at up to 2.3 GHz. They are divided in two clusters, with the four efficiency cores only clock up to 1.8 GHz. Compared to the similar Helio G35, the G37 offers support for 90 Hz displays and 8 GB RAM.
The performance of the G37 is positioned in the entry level and especially the single core performance is very slow due to the small A53 cores and no big performance cores.
Furthermore, the SoC integrates a LTE Cat.4 modem, a Wi-Fi 5 / Bluetooth 5.0 modem, a LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 memory controller, a IMG PowerVR GE8320 graphics card, and a 1080p30 video de- and encoder (H.265 decoding, H.264 encoding).
The G37 is produced in 12nm FinFET.
| Model | Qualcomm Snapdragon 460 | Mediatek Helio G25 | Mediatek Helio G37 | ||||||||||||||||||||||||||||||||
| Codename | Cortex-A73 / 53 | Cortex-A53 | Cortex-A53 | ||||||||||||||||||||||||||||||||
| Series | Qualcomm Snapdragon | Mediatek Mediatek Helio G | Mediatek Mediatek Helio G | ||||||||||||||||||||||||||||||||
| Clock | 1800 MHz | 2000 MHz | 1800 - 2300 MHz | ||||||||||||||||||||||||||||||||
| Cores / Threads | 8 / 8 | 8 / 8 | 8 / 8 | ||||||||||||||||||||||||||||||||
| Technology | 14 nm | 12 nm | 12 nm | ||||||||||||||||||||||||||||||||
| Features | Adreno 510 GPU, X11 LTE Modem (Cat 13 / 12) | UMTS/HSPA+, LTE Cat. 4, LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 Memory Controller, 1080p30 H.264 Video Encoder, H.264 / H.265 1080p30 Decoder | UMTS/HSPA+, LTE Cat. 4, Cat-7 DL / Cat-13 UL, LPDDR3-933 / LPDDR4-1200 / LPDDR4x-1600 Memory Controller, 1080p30 H.264 Video Encoder, H.264 / H.265 1080p30 Decoder | ||||||||||||||||||||||||||||||||
| iGPU | Qualcomm Adreno 610 | PowerVR GE8320 ( - 650 MHz) | PowerVR GE8320 ( - 680 MHz) | ||||||||||||||||||||||||||||||||
| Architecture | ARM | ARM | ARM | ||||||||||||||||||||||||||||||||
| Announced | |||||||||||||||||||||||||||||||||||
| Manufacturer | www.qualcomm.com | www.mediatek.com | www.mediatek.com | ||||||||||||||||||||||||||||||||
| Series: Mediatek Helio G Cortex-A53 |
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Benchmarks
Average Benchmarks Qualcomm Snapdragon 460 → 100% n=14
Average Benchmarks Mediatek Helio G25 → 57% n=14
Average Benchmarks Mediatek Helio G37 → 69% n=14
- Average benchmark values for this graphics card* Smaller numbers mean a higher performance
1 This benchmark is not used for the average calculation
